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Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method

A slide mobile phone and the technology of its manufacturing method, which are applied in the fields of multi-layer circuit manufacturing, branch office equipment, telephone communication, etc., can solve the problems that stress cannot be eliminated, product hardness increases, and bending is difficult, etc., so as to increase the bending life and flip the life. The effect of increasing and decreasing the thickness

Inactive Publication Date: 2011-09-14
ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] ① As the number of product layers and material thickness increase, the hardness of the product increases, making it difficult to bend;
[0004] ② The stress generated after assembly cannot be eliminated, resulting in a decrease in life;
[0005] ③ The stress generated during the bending process cannot be eliminated, resulting in a decrease in life

Method used

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  • Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method
  • Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method
  • Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method

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Embodiment Construction

[0022] Such as figure 1 , figure 2 As shown, the present embodiment takes a flip phone as an example, and a slide phone is similar to it. The invention relates to a layered FPC for moving around the rotating shaft of a clamshell mobile phone. Data between the motherboard on the flip cover. The layered FPC is a multi-layer board, including at least two layers of FPC veneers 3 and an adhesive layer 4 arranged in a partial area between two adjacent layers of FPC veneers 3, and the adhesive layer 4 is a prepreg or adhesive Adhesive film, the number of layers of FPC veneer 3 is generally designed to be 2 to 8 layers; in the bending area 1 in the middle part of the layered FPC, each layer of FPC veneer 3 is freely separated, and the FPC of two adjacent layers There is no adhesive layer 4 between the veneers 3; the adhesive layer 4 is arranged between the FPC veneers 3 of each layer in the fixed area 2 at both ends of the layered FPC and fixed tightly, and the fixed Area 2 is de...

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Abstract

The invention discloses a layered FPC (flexible printed circuit) which has simple design and can obviously improve the life of a flip or slider of a flip / slider phone and a manufacturing method. The layered FPC is connected between a phone mainboard and an upper flip / slider mainboard and comprises at least two layers of FPC single boards (3) and adhesive layers (4) arranged in the partial areas between the two adjacent layers of FPC single boards (3); the FPC single boards (3) are freely separated from each other and the adhesive layers (4) are not arranged between the two adjacent layers of FPC single boards (3) in a buckling area (1) in the middle part of the layered FPC; and the adhesive layers (4) are arranged among the FPC single boards (3) in fixed areas (2) at the two ends of the layered FPC and tightly fix the FPC single boards (3). The manufacturing method is characterized by adopting single sided boards for production, bonding the layers with adhesive films or prepregs, pre-punching the adhesive films or prepregs in the area needing to be layered and then laminating the partial punched adhesive films or prepregs with all layers of single sided boards.

Description

technical field [0001] The invention relates to a flexible printed circuit board and a manufacturing method, in particular to a layered FPC for flip / sliding mobile phones and a manufacturing method. Background technique [0002] With the development of the market, mobile phones have entered thousands of households. Flip mobile phones and slider mobile phones have always occupied a large proportion in the mobile phone market because of their stylish appearance and complete functions. As flexible printed circuit boards are increasingly used in consumer electronics such as clamshell and slider fashion mobile phones, the bending life of products has become the focus of people's attention and complaints, and it is also the focus of customer quality control. The upper cover of the flip phone rotates around the rotating shaft. During the flipping process, the rotating shaft FPC moves around the rotating shaft, and the data of the upper and lower covers are transmitted through the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH04M1/0277
Inventor 林均秀
Owner ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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