This invention relates to the field of
electronic packaging technology and discloses a multi-
physics coupled packaging
simulation method, including S1, macroscopic
equivalent model construction, which establishes a macroscopic packaging model containing multi-
physics loads and performs equivalent
processing on the microscopic complex structure to efficiently obtain the overall temperature, displacement, and
stress distribution; S2, key region identification, which combines macroscopic equivalent modeling with microscopic fine modeling and establishes a
macro-micro
bidirectional coupling mechanism to enable the macroscopic structural response and microscopic local behavior to be solved collaboratively under the same analysis framework; at the same time, combined with an adaptive iteration strategy, the microscopic model is dynamically introduced only in key high-risk areas to avoid the degree-of-freedom explosion problem caused by global fine modeling, thereby significantly reducing the overall computational scale while ensuring the accuracy of stress and strain prediction in key areas, effectively solving the problem of "difficulty in balancing accuracy and efficiency" in the prior art, and achieving a unity of high efficiency and high accuracy in multi-scale
simulation.