Circuit board and processing method thereof
A processing method and circuit board technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., can solve problems that limit product application and development, affect the electromagnetic performance of PCB products, and achieve guaranteed The effect of electromagnetic properties
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[0018] like figure 1 As shown, the embodiment of the present invention provides a circuit board processing method, which mainly includes:
[0019] 101, first make the first core board 1 and the second core board 2, the first core board 1 or the second core board 2 can be formed by cladding copper on the base material (single-sided or double-sided), which can include two layers or multi-layer lines;
[0020] 102. Fix the first core board 1 and the conductive coil 3 with the port 5 in a certain way, and the conductive coil 3 can be as follows figure 2 As shown, it includes one or more turns of conductive wire 4 and port 5. The conductive wire 4 can be copper wire, gold wire, silver wire or aluminum wire, or it can be made of a mixture of various metals in copper, gold, silver and aluminum. Specifically, the conductive coil 3 can be welded to the first core board 1, and the conductive paste used for welding can be solder paste, copper paste or silver paste, etc., or the conduc...
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Abstract
Description
Claims
Application Information
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