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Surface acoustic wave atomizer

A surface elastic wave and atomization device technology, which is applied in spraying devices, liquid spraying devices, climate sustainability, etc., to achieve stable and efficient atomization and avoid short circuits

Active Publication Date: 2011-09-21
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the protection of the interdigital electrodes depends entirely on the reliability of the insulating film, and is not a preferable configuration.

Method used

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Examples

Experimental program
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Effect test

no. 1 approach

[0031] Hereinafter, a surface acoustic wave atomization device according to an embodiment of the present invention will be described with reference to the drawings. figure 1 (a), (b), figure 2 The surface acoustic wave atomization device according to the first embodiment is shown. The surface acoustic wave atomization device 1 is provided with: a piezoelectric substrate 3, which has a pattern electrode 2 on a surface S that excites a surface acoustic wave W by applying a high-frequency voltage; The atomizing area 30 on the S supplies the liquid M; the contact fixture 5 has an electrode column 51 for applying a voltage to the pattern electrode 2, and is assembled on the piezoelectric substrate 3 from above the pattern electrode 2; the support plate 6, which It is a base member that supports the piezoelectric substrate 3 from below, and the surface acoustic wave atomization device 1 atomizes the liquid M supplied to the surface S of the piezoelectric substrate 3 by the liquid ...

no. 2 approach

[0043] combine Figure 4 A surface acoustic wave atomization device according to a second embodiment will be described. Compared with the first embodiment, the surface acoustic wave atomization device 1 of the present embodiment differs in the method of forming the micro-slits 11 , but is the same in other respects. That is, instead of forming the inner surface of the lower surface 40 , the surface 41 of the lower surface 40 of the liquid supply member 4 in the region sandwiched by the two grooves 42 is formed with irregularities obtained by roughening the lower surface 40 . The surface 41 formed with unevenness due to such roughening is in contact with the surface S of the piezoelectric substrate 3 , thereby exerting the same effect as that of the above-described micro slits 11 .

[0044] The minute slit 11 in the above-mentioned first embodiment is as fine as about 0.1 to 0.3 μm, and therefore may be affected by machining accuracy and mounting errors. In addition, it was f...

no. 3 approach

[0047] Figure 5 , Figure 6 The surface acoustic wave atomization device according to the third embodiment is shown. Compared with the first and second embodiments, the surface acoustic wave atomization device 1 of this embodiment is different in the position where the micro slit 11 is formed on the piezoelectric substrate 3 , but is the same in other respects. That is, the minute slit 11 is formed in a region on the surface of the piezoelectric substrate 3 where the surface acoustic wave W is not excited. The central region 31 along the longitudinal direction of the piezoelectric substrate 3 is a region where the surface acoustic wave W propagates, and the surface acoustic wave W does not exist in regions on both sides of the region 31 . A region A1 that retains and induces the liquid M is formed in a region on one side where the surface acoustic wave W does not exist. In addition, a protruding portion facing the center line of the piezoelectric substrate 3 is formed at t...

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Abstract

With the surface acoustic wave atomizer, a liquid is fed reliably at a constant quantity each time to an atomizing area on a substrate surface while distribution of the liquid on the substrate surface is also limited, and reliable, efficient atomizing and limited degradation such as of interdigital electrodes are realized using a simple configuration. The atomizer (1) is provided with a piezoelectric substrate (3) that has a pattern electrode (2) on the surface (S) and a liquid feed member (4) that feeds a liquid (M) to the surface (S), and the liquid (M) fed to the surface (S) is atomized by an surface acoustic wave (W). A tiny gap (11) is provided in an area (A1) intended to hold and guide the liquid (M) between the liquid feed member (4) and the surface (S) of the piezoelectric substrate (3), a large gap (12) is provided in an area (A2) not intended to feed the liquid (M). The liquid (M) is fed to an atomizing area (30) in an area away from the pattern electrode (2) on the surface (S) of the piezoelectric substrate (3) using the difference in surface tension produced by the gap sizes. The liquid (M) can be fed reliably by the tiny gap (11), and the distribution of the liquid (M) can be limited by the large gap (12).

Description

technical field [0001] The present invention relates to an atomizing device using surface acoustic waves. Background technique [0002] Conventionally, it is known that when a liquid is supplied to the surface of a substrate such as a piezoelectric material propagating a surface acoustic wave, the liquid receives the energy of the surface acoustic wave, flows or vibrates, and then flies as fine particles. Various devices for atomizing liquids utilizing this phenomenon have been proposed. The atomization principle has been explained as follows: the surface elastic wave (Rayleigh wave) propagating on the surface of the substrate enters the interior of the liquid and becomes a surface tension wave (capillary wave) propagating on the surface, and as a result, a wave is generated from the surface of the liquid. fog etc. [0003] High-frequency power is applied to the interdigitated electrodes formed on the surface of the piezoelectric substrate to excite the surface acoustic wa...

Claims

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Application Information

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IPC IPC(8): B05B17/06F24F6/12
CPCA61M15/0085B05B17/063A61M2205/0294B05B17/0623B05B17/0607Y02B30/80F24F6/12F24F2006/125B05B17/0676H02N2/08A61M15/02Y02B30/70
Inventor 石上阳平
Owner PANASONIC CORP
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