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Process for producing insulation type electronic component carrying tape

A technology of electronic components and production process, which is applied in the field of production process of electronic component carrier tape, can solve the problems of high production cost and low product quality, and achieve low production energy consumption, high heat distortion temperature, production efficiency and product quality high quality effect

Active Publication Date: 2014-05-07
ZHEJIANG JIEMEI ELECTRONICS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of high production cost and low product quality in the production of existing electronic component carrying tapes using a two-stage process, and discloses an integrated and continuous production of insulating type carrying tape pockets. Manufacturing process of electronic component carrier tape

Method used

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  • Process for producing insulation type electronic component carrying tape
  • Process for producing insulation type electronic component carrying tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A manufacturing process of an insulating carrier tape for electronic components, comprising the following steps in turn: (1) making a polymer raw material into a thin film fluid, and processing the film fluid into an intermediate product of the carrier tape with pockets through a convex-concave mold, said polymerizing The raw material of the product is a mixture of general-purpose polystyrene and high-impact polystyrene. According to the mass ratio, general-purpose polystyrene is 70%, and high-impact polystyrene is 30%. Left and right; (2) punching and trimming the intermediate product of the carrier tape to obtain the finished product of the insulating type electronic component carrier tape.

[0020]In the above step (1), the polymer raw material is made into a film fluid through an extruder, and the convex and concave molds move in the same direction as the film exiting direction of the extruder and the moving speed is the same as the film exiting speed of the extruder...

Embodiment 2

[0028] A manufacturing process of an insulated electronic component carrier tape, the process steps are the same as in Example 1, the difference is that the proportions of general-purpose polystyrene and high-impact polystyrene in the polymer raw materials are different, and according to the mass ratio, General-purpose polystyrene is 80%, high-impact polystyrene is 20%, and the temperature of the convex-concave mold for film processing is controlled at about 200°C. The flow velocity of the film fluid is 18 m / min, and the downward movement speed of the convex and concave molds is consistent with the flow velocity of the film.

Embodiment 3

[0030] A manufacturing process of an insulated electronic component carrier tape, the process steps are the same as in Example 1, the difference is that the proportions of general-purpose polystyrene and high-impact polystyrene in the polymer raw materials are different, and according to the mass ratio, General-purpose polystyrene is 90%, high-impact polystyrene is 10%, and the temperature of the convex-concave mold for film processing is controlled at about 205°C; the flow speed of the film fluid is 22 m / min, and the downward movement speed of the convex-concave mold is the same as that of the film Flow speed is consistent.

[0031] Following table is the data comparison of traditional product and 3 embodiments of this patent.

[0032]

[0033] The table below is a comparison of data at different processing temperatures for thin film fluids.

[0034]

[0035] It can be seen from the above table that the temperature of the film fluid during processing is between 195°C a...

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Abstract

The invention relates to a process for producing an insulation type electronic component carrying tape. The process for producing the insulation type electronic component carrying tape successively comprises the following steps of: (1) preparing a polymer raw material into a thin film fluid, and processing the thin film fluid into a carrying tape intermediate product with a pocket by virtue of a convex-concave die, wherein the polymer raw material is mixture of general polystyrene and high impact polystyrene; based on a mass ratio, the general polystyrene accounts for 70-90% and the high impact polystyrene accounts for 10-30%; and the temperature during processing a thin film by virtue of the convex-concave die is controlled to be 190-210 DEG C; and (2) carrying out punching and trimming on the carrying tape intermediate product to obtain the insulation type electronic component carrying tape finished product. The process for producing the insulation type electronic component carrying tape has the advantage of low production energy consumption, the length and thickness can be adjusted at will, the production efficiency and product quality are high, the insulating property is good, especially the tensile strength is high, and the operating temperature and the thermal deformation temperature are greatly increased.

Description

technical field [0001] The invention relates to a manufacturing process of an electronic component carrier tape, in particular to a manufacturing process of an insulating electronic component carrier tape. Background technique [0002] In the entire electronic product industry chain, the production of electronic component packaging and transportation carrier belts occupies a very important link. Electronic component packaging and transport carrier tape not only provides a medium for loading and transporting semiconductor integrated circuit electronic components, but more importantly, it is an important material that is essential for the subsequent high-speed, automated surface mount. With the invention and development of surface mount technology, the packaging form of semiconductor integrated circuits has gradually changed from the traditional pin type to the surface mount type, and the carrier tape of semiconductor electronic components has also emerged as the times require...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29D29/00B29C47/14B29C51/18B65D73/02B29C48/305
Inventor 张澎涛
Owner ZHEJIANG JIEMEI ELECTRONICS & TECH
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