An electronic component carrying belt molding machine and its use method

A technology for electronic components and carrier tapes, applied in the field of forming machines for electronic components carrier tapes, can solve the problems of low product quality and high production costs, and achieve the effects of improving production efficiency, ensuring quality stability, and ensuring accuracy

Active Publication Date: 2011-12-21
ZHEJIANG JIEMEI ELECTRONICS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of high production cost and low product quality in the production of the existing electronic component carrying tapes using a two-stage process, and discloses an integrated and continuous production of electronic components with carrying tape pockets. A forming machine for device carrying tape, and a method for using an electronic component carrying tape forming machine capable of integrated and continuous production of carrying tape pockets is disclosed

Method used

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  • An electronic component carrying belt molding machine and its use method
  • An electronic component carrying belt molding machine and its use method
  • An electronic component carrying belt molding machine and its use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 The shown one kind of forming machine for carrying tape of electronic components includes a film extrusion die head 1, a punch 2, a punch lateral movement mechanism 5, a punch longitudinal movement table 4, a punch base 3, a die 21, a die The lateral movement mechanism 51, the die longitudinal moving table 41 and the die base 31 correspond to the shapes of the punch 2 and the die 21, and the positions of the punch 2 and the die 21 correspond to the film extrusion die 1. The punch longitudinal moving platform 4 is installed on the punch base 3, and the punch longitudinal moving platform 4 moves up and down through the guide rail 6 installed on the punch base 3, and the punch 2 is installed on the punch longitudinal moving mechanism 5 through the punch on mobile station 4. The die longitudinal moving table 41 is installed on the die base 31, and the die longitudinal moving table 41 moves up and down through the guide rail 61 installed on the die base 31,...

Embodiment 2

[0040] The structure of the forming machine for carrying tape for electronic components is the same as that of Embodiment 1, and the temperature of the film fluid in step 1 of the method for using the forming machine for carrying tape for electronic components is between 231°C and 270°C. If the temperature of the production process is higher than 270°C, the plastic particles cannot form a film continuously, which will easily cause the carrier belt to break, and continuous production cannot be carried out, requiring intermittent shutdown. The flow velocity of the film fluid is 18 m / min, and the downward movement speed of the punch and die is consistent with the flow velocity of the film.

Embodiment 3

[0042] The structure of the forming machine for carrying tape for electronic components is the same as that of Embodiment 1, and in step 1 of the method for using the forming machine for carrying tape for electronic components, the polymer raw material is general-purpose polystyrene particles. The flow speed of the film fluid is 22 m / min, the downward movement speed of the punch and the die is consistent with the flow speed of the film, and the temperature is controlled between 190°C and 230°C. The products processed by the film fluid in the above temperature range are resistant The tensile strength performance is the best, the use and heat deformation temperature are the highest, and the tensile strength performance of the product produced at a temperature below 190°C is increased by 30%, and the use and heat deformation temperature is increased by 10%, compared with a temperature above 230°C and below 270°C The tensile strength of the products produced is increased by 20%, an...

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PUM

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Abstract

The invention relates to a forming machine for integrally producing an electronic component bearing band. The forming machine of the electronic component bearing band comprises a film extruding die head, a convex die, a convex die horizontal movement mechanism, a convex die longitudinal movement table, a convex die base, a concave die, a concave die horizontal movement mechanism, a concave die longitudinal movement table and a concave die base, wherein the convex die and the concave die have corresponding shapes, and the positions of the convex die and the concave die are corresponding to thefilm extruding die head. The electronic component bearing band produced by the forming machine of the electronic component bearing band has the advantages of low production energy consumption, randomly adjustable length and thickness, high production efficiency and product quality, high tensile strength, and greatly increased use and heat distortion temperatures.

Description

technical field [0001] The invention relates to a forming machine for integrated production of electronic component carrying tapes, in particular to a forming machine for making electronic component carrying tapes with carrying tape pockets. Background technique [0002] In the entire electronic product industry chain, the production of electronic component packaging and transportation carrier belts occupies a very important link. Electronic component packaging and transport carrier tape not only provides a medium for loading and transporting semiconductor integrated circuit electronic components, but more importantly, it is an important material that is essential for the subsequent high-speed, automated surface mount. With the invention and development of surface mount technology, the packaging form of semiconductor integrated circuits has gradually changed from the traditional pin type to the surface mount type, and the carrier tape of semiconductor electronic components h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C69/00
Inventor 方隽云
Owner ZHEJIANG JIEMEI ELECTRONICS & TECH
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