Manufacturing process for conductive carrying belt of electronic element

Abstract

Disclosed is a manufacturing process for a carrying belt of an electronic element. A manufacturing process for a conductive carrying belt of the electronic element comprises the following steps in turn: (1) making a polymer raw material into a film fluid and adopting a convex-concave mould to process the film fluid into a intermediate product of the carrying belt with a pocket, wherein the polymer raw material is the mixture of 70-90% of general polystyrene and 10-30% of graphitized carbon black by mass percent; and the temperature for processing the film fluid with the convex-concave mould is controlled within a temperature range of 210 DEG C to 230 DEG C, and (2) punching and trimming the intermediate product of the carrying belt, thereby acquiring an end product of the conductive carrying belt of the electronic element. The manufacturing process for the conductive carrying belt of the electronic element has the advantages that the energy consumption of production is low, the length and the thickness both can be adjusted randomly, the production efficiency and the product quality are high, the conductivity is excellent, especially, the tensile strength is high, and the use temperature and the heat deformation temperature are greatly promoted.

Description

technical field [0001] The invention relates to a manufacturing process of an electronic component carrier tape, in particular to a manufacturing process of a conductive electronic component carrier tape. Background technique [0002] In the entire electronic product industry chain, the production of electronic component packaging and transportation carrier belts occupies a very important link. Electronic component packaging and transport carrier tape not only provides a medium for loading and transporting semiconductor integrated circuit electronic components, but more importantly, it is an important material that is essential for the subsequent high-speed, automated surface mount. With the invention and development of surface mount technology, the packaging form of semiconductor integrated circuits has gradually changed from the traditional pin type to the surface mount type, and the carrier tape of semiconductor electronic components has also emerged as the times require,...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of high production cost and low product quality caused by the two-stage process used in the production of the existing electronic component carrier tape, and discloses an integrated and continuous production with good tensile strength. Manufacturing process of conductive electronic component carrier tape with carrier tape pockets with high use and heat distortion temperature

Images