One-sided silicon wafer wet etching equipment

Abstract

The invention discloses one-sided silicon wafer wet etching equipment. The equipment comprises a liquid feeding device (1), an etching chamber (2) and a remaining liquid processing device (3), wherein the liquid feeding device (1) sprays a high-temperature alkaline etching liquid onto a silicon wafer rotating on a vacuum chuck in the etching chamber (2) to carry out reaction rate and surface finish controlled anisotropic wet etching on the silicon wafer; at the same time, the silicon wafer is tightly fit with the vacuum chuck in the etching chamber (2); and the fitting surface is isolated from the etching environment to realize protection of the one-sided silicon wafer. The equipment has the following beneficial effects: one-sided wet etching is carried out by spraying the high-temperature alkaline etching liquid onto the silicon wafer rotating on the vacuum chuck and vacuum is utilized to effectively isolate the side to be protected from the etching environment, thus solving the problem that long-time one-sided protection is difficult to implement on the silicon wafer in the tradition wet etching processes.

Description

technical field [0001] The invention relates to the technical field of bulk silicon processing in MEMS processing technology, and in particular to a single-side silicon wafer wet etching equipment, which effectively protects the back side of the silicon wafer from being corroded while performing single-side bulk silicon removal. Background technique [0002] The use of etching and other microfabrication techniques to fabricate miniaturized microstructures has become increasingly common in many areas of science and engineering. Silicon and other semiconductor materials can be used not only to make discrete and integrated electronic circuits, but also to make sensors, actuators, and other devices with new properties due to the miniaturization of the materials used and the scale. During the processing of silicon-based devices, it is often necessary to use anisotropic wet etching to remove a large amount of silicon to form microstructures such as cavities, trenches, and bridge s...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that traditional methods cannot effectively protect silicon wafers that require long-term unilateral wet etching, the present invention provides a single-sided silicon wafer wet etching equipment to The need for effective protection on one side of the chip

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