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Encapsulating bracket structure for high-reliability luminous device

A technology for light-emitting devices and packaging brackets, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the operating temperature of light-emitting diode chips, reducing the reliability of light-emitting diodes, poor solderability, etc. Reliability, the effect of improving reliability

Inactive Publication Date: 2011-10-12
SDI CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the back of the bracket (40) of the reference proposal is used to combine with substrates such as circuit boards by soldering and has a planar design, but because the solder is easily deteriorated due to high-temperature use conditions, the poor solderability of the range occurs. , Therefore, the existing structural design can only be applied to the design of lower power, but with the increase of high power demand, the operating temperature of the LED chip will also increase, which is more likely to lead to the deterioration of the solder, and reduce the The reliability of light-emitting diodes

Method used

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  • Encapsulating bracket structure for high-reliability luminous device
  • Encapsulating bracket structure for high-reliability luminous device
  • Encapsulating bracket structure for high-reliability luminous device

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Embodiment Construction

[0031] The present invention provides a high-reliability packaging support structure for light-emitting devices, please refer to Figures 1 to 3 , it can be seen from the figure that the light-emitting device packaging bracket structure of the present invention includes a bracket (10) and a light cup body (20), and the bracket (10) is formed with a base (12) and a plurality of conductive pins (14), wherein, the conductive pins (14) can extend horizontally relative to the base (12), so that the packaging support structure has a thinner design, and can be used in thinner screens and televisions, etc. The conductive pin (14) can also be bent relative to the base (12), so that the packaging support structure is suitable for different design occasions. The support (12) has a front and a back, and the front of the support (10) A protruding part (122) is formed on the base (12), so that there is a difference between the base (12) and the conductive pin (14), which is not coplanar, an...

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Abstract

The invention provides an encapsulating bracket structure for a high-reliability luminous device. The encapsulating bracket structure for the high-reliability luminous device mainly comprises a pitted surface area which is formed on the back surface of a bracket. By the pitted surface area, the condition that the welding effect is poor because solder is degraded at high temperature can be avoided, the tin welding property of the bracket can be improved, the diffusion of tin paste can be effectively controlled, and the whole heat radiating area of the bracket can be enlarged.

Description

technical field [0001] The present invention relates to a packaging support structure for a light emitting device, in particular to a packaging support structure for a light emitting device with pockmarked areas and high reliability. Background technique [0002] Existing light-emitting diode packaging structure, such as the structure of Taiwan No. I277223 "A LED Package with Low Thermal Resistance" (hereinafter referred to as the reference case), please refer to Figure 11 As shown, it has a support (40) formed with pins and an insulating material (50). The support (40) forms a positive lead frame (42), a negative lead frame (44) and a The chip carrying lead frame (46) of the diode chip (60), the insulating material (50) is molded to surround the frame (40), and a solid crystal region (52) is formed. [0003] However, the back of the bracket (40) of the reference proposal is used to combine with substrates such as circuit boards by soldering and has a planar design, but bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64
Inventor 刘俊杰王启全
Owner SDI CORPORATION
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