Scale-span design method for interface structure of micro/nano/photoelectronic device

A technology of optoelectronic devices and interface structures, which is applied in the fields of instruments, computing, and electrical digital data processing, etc., can solve the problems of insufficient, increased computing time, huge time, etc., and achieve the effect of high efficiency and solving design problems
CN102222142AInactive Publication Date: 2011-10-19JIANGSU UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
JIANGSU UNIV
Publication Date
2011-10-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a scale-span design method for an interface structure of a micro / nano / photoelectronic device, which comprises the following steps of: designing a coupling area of a finite element and an interface element, and an interface element coupling area of molecular dynamics; constructing a finite element, interface element and molecular dynamics coupled model; solving a finite element equation in the finite element area by using a finite element method, and converting the finite element equation to a boundary of the interface element area to solve the interface element area; assigning atoms in the finite element coupling area of the molecular dynamics and converting the solution of the finite element area into a boundary condition of the atoms in the molecular dynamics area; initiating molecular dynamics solving in the molecular dynamics area, and solving new positions of atoms by using a non-equilibrium molecular dynamics model; and finally determining system balance of the molecular dynamics area. By the method, the energy coupled transfer is realized systematically, the macro / micro / nano simulation of interface characteristics of the micro / nano / photoelectronic device is realized, and the method has the characteristics of precision, scientific property and high efficiency.
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Description

technical field

[0001] The invention relates to microscopic to macroscopic numerical simulation, in particular to a cross-scale coupling design method for the microstructure interface of micro / nano / optoelectronic devices. Background technique

[0002] Multi-layer structures and multi-interfaces are ubiquitous phenomena in electronic devices themselves as well as in device interconnection and packaging. Interface delamination failure has become an important concern in product performance and reliability. Foreign researchers have found through a large number of experiments that the interface is a key part in the manufacture and operation of microsystems, and many damages and defects occur near the interface. However, the research on the interface law of microscopic materials has just started, and the macroscopic theory based on continuum mechanics is no longer applicable. The physical characteristics of the interface are not only related to the geometry of the microstructure ...

Claims

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