Heat pump type hot water supply apparatus

A hot water supply device and heat pump technology, which can be used in residential hot water supply systems, hot water central heating systems, heating methods, etc., and can solve problems such as inability to fully utilize various

Active Publication Date: 2011-11-09
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the refrigeration, heating and hot water supply device and its control method according to the prior art, there is a problem that the refrigerant compressed by the compressor is only used for hot water supply and air conditioning, and cannot be fully utilized in various ways.

Method used

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  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus

Examples

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Embodiment Construction

[0032] Embodiments of the present invention that specifically achieve the above objects will be described below with reference to the drawings. In the following description, the same names and symbols will be used for the same structures, and additional explanations related thereto will be omitted.

[0033] figure 1 is a schematic diagram showing an embodiment of a heat pump hot water supply device according to the present invention, figure 2 It is a block diagram showing an embodiment of the heat pump hot water supply device according to the present invention.

[0034] The air conditioner in this embodiment includes: a refrigeration cycle circuit 2, which enables the first refrigerant to perform indoor air conditioning; a hot water supply circuit 6, which enables the first refrigerant to be used for hot water supply; a heat storage circuit 10 , which utilizes the first refrigerant and the second refrigerant for heat storage.

[0035] The refrigeration cycle circuit 2 form...

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Abstract

A heat pump-type hot water supply apparatus may be provided that includes: a refrigeration cycle circuit (including a compressor, an outdoor heat exchanger, expansion devices, and an indoor heat exchanger); a hot water supply heat exchanger connected to the refrigeration cycle circuit to use the first refrigerant discharged from the compressor for a hot water supply; a cascade heat exchanger connected to the refrigeration cycle circuit to allow the first refrigerant passing through the hot water supply heat exchanger to evaporate a second refrigerant and thereafter, to be condensed, expanded, and evaporated in the refrigeration cycle circuit; a heat storage compressor compressing the second refrigerant evaporated in the cascade heat exchanger, a heat storage tank to heat water using the second refrigerant compressed by the heat storage compressor, and a heat storage expansion device to expand the second refrigerant condensed in the heat storage tank. Since the heat pump-type hot water supply apparatus may increase the heat storage temperature and additionally use the refrigerant used for hot water supply and heat storage in space air-conditioning, it may be very efficient.

Description

technical field [0001] The present invention relates to a heat pump hot water supply device, in particular to a heat pump hot water supply device which utilizes the heat of refrigerant compressed in a compressor for hot water supply and can store heat. Background technique [0002] Generally speaking, a heat pump uses the heat of heat generation or condensation of a refrigerant to transfer a low-temperature heat source to a high-temperature one, or to transfer a high-temperature heat source to a low-temperature refrigeration and heating device. [0003] A heat pump includes a compressor, an outdoor heat exchanger, an expansion mechanism, and an indoor heat exchanger. Recently, a heat pump type hot water supply device tends to be developed, which uses refrigerant compressed in a compressor to heat water and use it for hot water supply, so that Consumption of fossil fuels becomes minimal. [0004] JP 2001-263857A (2001.9.26) discloses a cooling and heating hot water supply de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B29/00F25B41/06F25B41/04
CPCF24D2200/31Y02B30/52F24F1/0003F24D3/18Y02B30/12F24D17/02F24F2203/021F24F2221/54F24F5/0096
Inventor 沈智燮朴鲁马朴熙雄
Owner LG ELECTRONICS INC
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