Front opening unified pod with elliptical latch structure

A wafer box and front-opening technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems that the box body 10 and the door body 20 cannot be smoothly closed, cannot be snapped in, and process troubles, etc.

Active Publication Date: 2011-11-09
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method similar to lateral traction tends to generate an offset force in the moving direction of the movable spigot 231, which will cause it to fail to be inser...

Method used

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  • Front opening unified pod with elliptical latch structure
  • Front opening unified pod with elliptical latch structure
  • Front opening unified pod with elliptical latch structure

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Embodiment Construction

[0081] Since the present invention discloses a front-opening wafer box, it has a box body and a door body, a plurality of slots are provided inside the box body to accommodate a plurality of wafers horizontally, and a side surface of the box body has a The opening can be used for loading and unloading of the wafers, and the inner surface of the door is combined with the opening of the box body to protect multiple wafers inside the box body. In addition, at least one latch opening is configured on the outer surface of the door body for opening or closing the front-opening wafer cassette. Since the structures of some front-loading wafer cassettes utilized in the present invention are the same as those described above, their detailed manufacturing or processing processes are not fully described in the following description. Moreover, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their function is only to express the ...

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PUM

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Abstract

The invention relates to a front opening unified pod with an elliptical latch structure. The front opening unified pod mainly comprises a unified pod body; a plurality of slots are arranged inside the unified pod body and used for accommodating a plurality of wafers; an opening is formed on one side surface of the unified pod body and used for input and output of the plurality of wafers; one edge of the opening is provided with a door body; the door body is provided with an external surface and an internal surface, and the internal surface is combined with the opening of the unified pod body for protecting the plurality of wafers placed inside the unified pod body; the front opening unified pod is characterized in that: at least one latch structure is configured inside the door body, wherein the latch structure comprises an elliptical cam, a pair of sliding devices and a guide structure; the elliptical cam is provided with a pair of V-shaped grooves; a sliding groove is positioned on the surface of the elliptical cam; each sliding device is provided with an embedded part; the guide structure is arranged on the sliding device; and the embedded parts are embedded in the sliding groove and used for respectively embedding the pair of sliding devices on the elliptical cam.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a door latch structure disposed in the door body of the front-opening wafer box. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid external contamination, a sealed container is often used for automatic equipment delivery. Please refer to figure 1 Shown is a schematic diagram of a wafer box in the prior art. The wafer pod is a front opening type wafer pod (Front Opening Unified Pod, FOUP), which has a box body 10 and a door body 20. Inside the box body 10, there are multiple slots 11 which can accommodate multiple round pods horizontally. (not shown in the figure), and has an opening 12 on one side of the box body 10 for loading and unloading of the wafer, and the door body 20 has a...

Claims

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Application Information

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IPC IPC(8): H01L21/673
Inventor 邱铭乾林志铭
Owner GUDENG PRECISION IND CO LTD
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