An installation device for a vacuum processing system

Abstract

The present invention provides a mounting device for a vacuum processing system, which includes: a mounting plate disposed between an electrostatic chuck and a plurality of components below the electrostatic chuck for supporting the An electrostatic chuck and provides a connection interface for the plurality of components, which has one or more first connection holes; one or more first devices, which are located under the mounting plate, and which have one or more second connections Holes, the first device is made of a hard material that is not easy to deform, at least the lower half of which is insulated; a plurality of fixing devices are arranged on the upper surface of the mounting plate, and the fixing devices are passed through the first A connecting hole and a second connecting hole can fix the mounting plate. The present invention also provides a method for installing/uninstalling the above-mentioned installation device. Utilizing the invention, the installation device can be unloaded/installed conveniently and quickly.

Description

technical field [0001] The present invention relates to vacuum processing systems, and more particularly to cooling systems in plasma processing. Background technique [0002] In a vacuum processing system, the susceptor usually includes an electrostatic chuck, which is used to support and hold the silicon wafer to be processed. Taking the plasma etching machine as an example, the base also usually includes multiple pipes / lines, which are used to directly or indirectly act on the silicon wafer during the process to complete the processing of the silicon wafer, such as cooling pipes, gas supply pipes, etc. , water supply pipes, cables, etc. [0003] In order to isolate the electrostatic chuck from the above-mentioned pipelines / circuits, it is usually necessary to arrange a facility plate between the electrostatic chuck and the pipelines / circuits below it. Also, the mounting plate is used to host the electrostatic chuck and provide connections for multiple pipes / lines. [0...

AI Technical Summary

Problems solved by technology

[0006] In summary, the unloading mechanism of the installation device in the prior art is relatively complicated, which wastes manpower and material resources

Moreover, the semiconductor vacuum processing machine is a precision device, and the unloading mechanism of the existing technology may introduce pollutants such as particles, which will affect the process and waste manpower and material resources

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