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heat sink

A heat dissipation device and heat sink technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., and can solve problems such as differences in the service life of electronic components

Inactive Publication Date: 2011-12-07
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the electronic device is working, the heat sink on the electronic components at the upwind of the fan will block the airflow generated by the fan from blowing to the heat sink on the electronic components at the downwind of the fan, so that the temperature of the electronic components at different positions relative to the fan will be different. Larger differences, in the long run, will lead to differences in the service life of electronic components

Method used

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Embodiment Construction

[0020] Such as figure 1 and image 3 As shown, the heat dissipation device 10 of a preferred embodiment of the present invention is used to simultaneously dissipate two electronic components 32a, 32b arranged at intervals on a motherboard 30 installed in an electronic device, which includes two components mounted on the motherboard 30 The upper radiators 12a, 12b, a heat pipe 14 thermally connected to the two radiators 12a, 12b, and a fan 20 arranged adjacent to one of the radiators 12a and away from the other radiator 12b.

[0021] Please also refer to figure 2 Each heat sink 12a, 12b is made of copper, aluminum and other thermally conductive materials. It includes a rectangular heat-conducting plate 122 and a plurality of heat-dissipating fins 124 extending vertically upward from the upper surface of the heat-conducting plate 122. The lower surface of the heat conducting plate 122 is in thermal contact with a corresponding electronic component 32a, 32b. A longitudinal groove ...

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Abstract

A heat dissipating device is used for dissipating heat from two electronic components at the same time, which includes two heat sinks respectively in contact with the two electronic components in heat conduction, and a heat pipe connected between the two heat sinks by heat conduction. The heat pipe of the present invention is connected between the two radiators, and can conduct the heat of the electronic components at the downwind to the radiator on the electronic components at the upwind in time, so that even if the radiator at the electronic components at the upwind blocks the Even if the airflow blows to the radiator on the downwind electronic component, the temperature difference between the two electronic components will not be large.

Description

Technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat of electronic components. Background technique [0002] The electronic components installed on the circuit board will generate a lot of heat during operation. If this heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature, which will seriously affect the performance and life of the electronic components. For this reason, a heat sink is usually installed on the electronic components to dissipate heat. [0003] The motherboard in electronic devices such as computers or servers is usually equipped with multiple electronic components with higher power. The multiple electronic components are arranged on the circuit board at intervals, and each electronic component is provided with a separate heat sink for heat dissipation. Since the space in the electronic device is limited, each radiator uses a fan to dissipate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 谭子佳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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