Flexible electronic component and manufacturing method thereof

Abstract

The invention discloses a pliable electronic component and a manufacturing method thereof. The manufacturing method comprises the following steps of attaching a pliable substrate on a hard substrate through a weak-force interface layer; forming multiple array-arranged electronic components on the pliable substrate; dividing the hard substrate into multiple sub-substrate each provided with an electronic component; performing non-contact type cutting on the electronic components along at least a part of the functional part of each electronic component so as to form a first cutting channel between the functional part of each electronic component and a quasi part of the electronic component; performing contact type cutting on the pliable substrate and the weak-force interface layer along the first cutting channel so as to form a second cutting channel between the pliable substrate and the weak-force interface layer, wherein, the second cutting channel makes the sub-substrate part exposed; and removing the functional part and the pliable substrate located below the functional part from the sub-substrate. The method provided in the invention improves the manufacture good product rate of the pliable electronic component.

Description

technical field [0001] The present invention relates to an electronic component and its manufacturing method, and in particular to a flexible electronic component and its manufacturing method. Background technique [0002] Due to the characteristics of flexible electronic components such as thinness, flexibility, impact resistance, high safety and portability, flexible electronic components are bound to become the mainstream of the next generation. Generally speaking, there are two ways to fabricate flexible electronic components. One way is to directly fabricate electronic components on flexible substrates, and the other is to indirectly transfer electronic components to flexible substrates. superior. If the flexible electronic components are fabricated by directly fabricating electronic components on the flexible substrate, the flexible substrate must first be attached to the hard substrate by an adhesive layer, and then placed on the flexible substrate Make the required...

AI Technical Summary

Problems solved by technology

However, since the flexible substrate is closely attached to the rigid substrate through the adhesive layer, the electronic components on the flexible substrate will be damaged during the process of removing the flexible substrate from the rigid substrate. There is a possibility of damage, which will reduce the yield rate of flexible electronic components

For those with ordinary knowledge in this field, how to improve the problem of yield drop caused by the removal process of the flexible substrate is one of the problems to be solved urgently.

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