34results about How to "Less prone to warping" patented technology

Provided are a fiber-reinforced plastic producing method capable of easily producing a fiber-reinforced plastic in which swelling and warpage are less likely to occur and of which excellent mechanicalcharacteristics and isotropy are ensured, and a fiber-reinforced plastic in which swelling and warpage are suppressed from occurring. The fiber-reinforced plastic producing method has a step for obtaining a material (A) including a prepreg base material (12) in which a region (B) (17), where reinforcing fibers (13) pulled and aligned in one direction are impregnated with a matrix resin (14) and aplurality of cuts (b) (15) are formed, and a region (C) (18), where a plurality of cuts (c) (16) are formed, are alternately formed in a direction orthogonal to a fiber axis of the reinforcing fiber(13), a step for hot-pressing the material (A) while moving the material (A) under specific conditions, and a step for cooling the pressed material (A) to obtain the fiber-reinforced plastic.

The invention relates to a configuration method of self-catalyzed electroless copper-plating epoxy resin solution and an electroless copper-plating method, belonging to the technical field of material surface treatment. It includes the following steps: adding the active ion source into the organic solvent under constant stirring, and adding a certain amount of curing catalyst, stirring fully to form a uniform active agent solution; and then stirring the epoxy resin in a certain proportion Add to the curing agent to form an epoxy resin organic solution; while stirring continuously, slowly add the active agent solution to the epoxy resin organic solution to form a uniform and stable system, that is, to obtain an epoxy resin solution with self-catalytic active electroless copper plating . The prepared resin solution is uniformly coated on the printed circuit board substrate by casting method or screen printing method, and then through curing, micro-etching, reduction, chemical plating and other processes, the bright pink copper coating can be obtained. After the performance test, the copper layer-resin bonding force and electrical conductivity of the sample are excellent, and it is suitable for the electroless copper plating process.

The invention relates to the technical field of plastic board preparation, and more specifically, the invention provides a wood-plastic floor and a preparation method thereof. The first aspect of the present invention provides a wood-plastic floor, which is a substrate layer, a connecting layer, and a wear-resistant decorative layer from bottom to top; the substrate layer includes a first substrate layer and a second substrate from top to bottom layer; the wear-resistant decorative layer includes a wear-resistant protective layer and a printed decorative layer from top to bottom; the wear-resistant protective layer includes a wear-resistant UV coating layer and a transparent protective layer from top to bottom; the printed decorative layer is from top to bottom Including the ink layer and the printing substrate layer.

The invention discloses a combustor of a gas stove, and relates to the technical field of combustors. The combustor comprises an outer ring, a positioning column, an outer ring air inlet injection pipe mechanism and a center air inlet injection pipe mechanism; an inner ring is arranged on the inner side of the outer ring, the inner ring is connected with the outer ring through a linking block, andthe outer ring air inlet injection pipe mechanism is arranged at the bottom of the outer ring. The combustor has the beneficial effects that according to the combustor of the gas stove, through a center mixing cavity and an outer ring mixing cavity, inner arcs of the center mixing cavity and the outer ring mixing cavity are distributed from deep to shallow, through the center mixing cavity and the outer ring mixing cavity, it is ensured that the air flow can be stable during mixing and free of buffer, combustion flames are evenly distributed, the two mixing cavities are formed in the bottom of the outer ring, when the device carries out combustion work, complete upper air inlet combustion is achieved, comprehensive oxygen supplementing is achieved, and the phenomenon that due to long-timecombustion of the combustor, due to insufficient oxygen supplementing, combustion insufficiency of red fire, yellow flames, black smoke and the like is caused is avoided.

An object of the present invention is to provide a single-sided protective polarizing film with an adhesive layer that can suppress defects due to nano-slits without providing a coating layer between the polarizer and the adhesive layer, and is excellent in reworkability . The single-side protective polarizing film with an adhesive layer of the present invention has a single-sided protective polarizing film having a protective film only on one side of a polarizer, and directly or via the polarizer side of the above-mentioned single-sided protective polarizing film. The coating layer has an adhesive layer, and the storage modulus of the above-mentioned adhesive layer at -40°C is 7.0×10 7 More than Pa, the adhesive force of the above-mentioned adhesive layer relative to the surface of the alkali-free glass at a peeling speed of 300mm / min and a peeling angle of 90 degrees is below 8N / 25mm, and the above-mentioned adhesive layer is relative to the glass with the ITO film. The adhesive force of the surface of the ITO film at a peeling speed of 300mm / min and a peeling angle of 90 degrees is below 8N / 25mm.

The invention relates to a method for manufacturing a chip packaging structure. The manufacturing method comprises the following steps of: (a) providing a substrate, wherein the substrate is provided with at least one conductive hole; (b) arranging the substrate on a carrier; (c) removing partial substrate to expose the conductive hole, and forming at least one penetration guide hole; (d) arranging a plurality of chips on the surface of the substrate, and electrically connecting the chips to the penetration guide hole of the substrate; (e) forming a coating material; (f) removing the carrier;(g) carrying out a chip bonding process; (h) removing the coating material; and (i) forming a protective material. Thus, the carrier and the coating material can ensure the substrate to be difficult to warp in a process.