Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Curable composition, cured object, overcoat film, and flexible wiring board and production method therefor

A curable composition and wiring board technology, applied in chemical instruments and methods, non-metallic protective layer coating, layered products, etc., can solve the problems of reduced yield of manufacturing process, adverse effects of positioning accuracy, etc., to achieve suppression Occurrence of wire breakage, excellent low warpage and wire breakage suppression, and less warpage effect

Pending Publication Date: 2022-02-18
NIPPON POLYTECH CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the flexible wiring board warps, it will adversely affect the positioning accuracy of the mounting position of the IC chip when the IC chip is mounted on the flexible wiring board in the packaging process, which may lead to a decrease in the yield rate in the manufacturing process. reduce

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curable composition, cured object, overcoat film, and flexible wiring board and production method therefor
  • Curable composition, cured object, overcoat film, and flexible wiring board and production method therefor
  • Curable composition, cured object, overcoat film, and flexible wiring board and production method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0197] Hereinafter, the present invention will be described in detail by examples and comparative examples.

[0198]

[0199] (Refer to Synthesis Example 1)

[0200] In the reaction vessel including a stirring device, a thermometer, and a condenser with a distiller, xylene chiphenic anhydride is added, 1,6-hexanediol 879.2g (7.44 mol), using oil bath The temperature of the reaction vessel was raised to 140 ° C and stirring was continued for 4 hours. Then, while continuing, the mono-n-butyltin oxide was added to 1.74 g.

[0201] Then, the inner temperature of the reaction vessel is slowly increased, and the pressure in the reaction vessel is gradually reduced by vacuum pump, and the water is separated to the reaction vessel by decompression distillation. In the end, the temperature was raised to 220 ° C, and the pressure was reduced to 133.32 Pa. After 15 hours, it was confirmed that the water was completely no longer distilled, the reaction ended.

[0202] The hydroxyl value of t...

Synthetic example 1

[0213] Equipped with a stirrer, a thermometer and a condenser was charged with 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (manufactured by Osaka Gas Chemical Co., Ltd., trade name BPEF) 10.7g , with reference to synthesis Example 1 synthesis of polyester diols 61.52g, 2,2- dimethylol propionic acid carboxyl group-containing diol (manufactured by Tokyo Kasei Co., Ltd.) 6.48g, γ- butyrolactone as a solvent ester 137.7g, was heated to 100 deg.] C to dissolve all material.

[0214] After the temperature of the reaction solution was lowered to 90 ℃, the methylene bis diisocyanate compound (4-cyclohexyl isocyanate) (manufactured by Sumika Bayer Urethane Co., Ltd. of DESMODUR-W (trade name)) 28.31g using a dropping dropping funnel over 30 minutes.

[0215] After reaction for 8 hours at 145 ~ 150 ℃, confirmed almost not observed the absorption of C = O stretching vibration of the isocyanate group caused by infrared spectroscopy (IR), 1.5g of ethanol was added dropwise to the reaction ...

Synthetic example 2

[0218] Except that in place of 11.4g of the compound represented by the following formula (7) 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene 10.7g addition, other operations in the same manner as in Synthesis Example 1 , to obtain an aromatic ring containing a carboxyl group and having a concentration of 3.1mmol / g, a concentration of urethane groups of 2.00mmol / g polyurethane solution (hereinafter referred to as "polyurethane solution A2"). .

[0219] Chemicals 8]

[0220]

[0221] The viscosity of the resulting polyurethane solution A2 was 120000mPa · s. Further, the number of the polyurethane solution A2 contained in the polyurethane-average molecular weight (Mn) of 15,000, an acid value of 24.8mgKOH / g. Further, the solid content concentration of the polyurethane solution A2 was 40.0 mass%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile yield strengthaaaaaaaaaa
acid valueaaaaaaaaaa
lengthaaaaaaaaaa
Login to View More

Abstract

Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible wiring board from a flexible substrate having wiring formed thereon, by coating the wiring-including surface portions of the flexible substrate with an overcoat film, the overcoat film being formed by curing the curable composition. The cured object obtained from this curable composition has a tensile modulus of 600-2,000 MPa and a tensile yield strength of 17 MPa or greater.

Description

Technical field [0001] The present invention relates to a curable composition, a cured product, an outer coating film, and a flexible wiring plate and a method of producing it. Background technique [0002] The outer coating film is coated on the flexible wiring board. The outer coating film is formed by coating a curing composition on a surface of a flexible substrate having a wiring or orneted by a printing method. With the fine wiring process of the circuit formed on the flexible wiring board, the module is lightweight, and the curable composition required to form an outer coating film is required to have the flexible wiring board than in the past. The performance of warpage occurs. If the flexible wiring board is warped, it will cause a negative effect on the positioning accuracy of the mounting position of the IC chip in the package step of the IC chip, and it is possible to result in a finished product in the manufacturing process. reduce. [0003] Among the prior art curab...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08L63/00B32B15/092C08K3/013H05K3/28
CPCH05K3/28C08L63/00C08G59/40B32B15/092C08K3/013C08L101/00C08K5/1515
Inventor 大贺一彦石桥圭孝山本龙之介
Owner NIPPON POLYTECH CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com