The invention relates to a compounding method of an
epoxy resin solution with
autocatalysis chemical
copper plating activity and a chemical
copper plating method, and belongs to the technical field of material surface treatment. The compounding method comprises the following steps: adding an activity
ion source to an
organic solvent under the circumstance of unceasingly stirring, adding a given number of curing catalysts, and sufficiently stirring the activity
ion source, the
organic solvent and the curing catalysts so as to form a uniform
active agent solution; adding
epoxy resins to a curing agent according to a certain proportion in a stirring manner so as to form an
epoxy resin organic solution; unceasingly stirring the epoxy resin organic solution, and besides, slowly adding the
active agent solution to the epoxy resin organic solution so as to form a uniform
stable system, namely obtaining a chemical
copper plating epoxy resin solution with
autocatalysis activity; enabling a compounded resin solution to form a uniform
coating on a basal board of a
printed circuit board by a
casting method or a silk
screen printing method, and performing the procedures of solidification, microetch, reduction,
chemical plating and the like so as to obtain a plating piece with a bright pink
copper plating layer. Through performance test, the copper layer-resin
binding force and the electrical
conductivity of samples are excellent, and the compounding method and the chemical
copper plating method are suitable for a chemical
copper plating technology.