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Autocatalysis cross-linking organosilicon-epoxide compound seal glue and method for making same

A composite sealing and cross-linking technology, used in epoxy resin adhesives, chemical instruments and methods, adhesives, etc., can solve the problems of not easy to obtain raw materials, low bonding strength, complicated processes, etc., to simplify the manufacturing process, The effect of excellent vulcanizate performance and low energy consumption

Inactive Publication Date: 2008-02-06
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the condensation-type silicone sealants and adhesives widely used at home and abroad have low bonding strength, and are often modified by adding epoxy resin or phenolic resin.
For example, patent ZL03133623 (a kind of epoxy-modified silicone resin adhesive) adopts epoxy-modified silicone resin as base glue and low molecular weight polyamide as curing agent, but the process is more complicated and the cost is higher; document (application number 200610068263.1 ring Oxygen-silicone hybrid resin composition and its manufacturing method, and light-emitting semiconductor device) introduces organohydrogen polysiloxane, aromatic epoxy resin or hydrogenated epoxy resin, adopts platinum series or aluminum series curing catalyst to prepare epoxy- Silicone mixed resin composition; but there are still disadvantages that the raw materials are not easy to obtain, the cost is high, and the process is cumbersome

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Mix 100 parts of α, ω-dihydroxy polydimethylsiloxane and 60 parts of nano-calcium carbonate at a vacuum degree of -0.095 MPa and a temperature of 110° C., vacuum dehydrate for 45 minutes, and cool to room temperature. The resulting mixed glue is ready for use.

[0016] Mix 1.18 parts of ethylenediaminemethyltriethoxysilane and 5 parts of epoxy resin E44, stir and mix with the above-mentioned mixed glue at room temperature and -0.095MPa vacuum for 15 minutes, and pour the prepared sealant into a deep 4 The mechanical properties of the vulcanized rubber were measured according to the provisions of GB / T13477-1992 test methods for building sealing materials after curing at room temperature for 7 days in a polytetrafluoroethylene mold of mm.

[0017] Use 80×10×3mm PE and PP injection specimens whose surface has been roughened by a grinder, glue them together, and test the shear strength of the silicone sealant according to GB / T13477-1992 adhesive tensile shear strength.

[0...

Embodiment 2

[0022] 1.46 parts of hexamethylenediaminemethyltriethoxysilane was used as the crosslinking agent, and the rest were the same as in Application Example 1. The properties of the sealant are shown in Table 1.

Embodiment 3

[0024] 1.38 parts of diethylenetriaminemethyltriethoxysilane was used as the crosslinking agent, and the rest were the same as in Application Example 1. The properties of the sealant are shown in Table 1.

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PUM

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Abstract

The invention discloses an autocatalytic crosslinking silicone-epoxide composite sealant and preparation method thereof. The sealant comprises an alpha, omega-dihydroxy polysiloxane, a low molecular weight epoxide resin, an alpha-aminomethyl trialkoxy silane and a filler. The invention has simple preparation method and solves problems in the prior catalytic silicone sealant of great catalyst toxic and side effects and weak bonding capability. The low molecular weight epoxide resin increases bonding performance of the sealant, and the alpha-aminomethyl trialkoxy silane crosslinks the silicone and the epoxide component simultaneously without additional catalyst. The invention has rapid curing rate, good thermal stability of vulcanizate, and applicability in adhesion and sealing of energy saving lamp and car lamp.

Description

technical field [0001] The invention relates to a self-catalyzed cross-linking organic silicon-epoxy composite sealant and a manufacturing method thereof, which are suitable for bonding and sealing energy-saving lamps and vehicle lamps. Background technique [0002] At present, the condensation-type silicone sealants and adhesives widely used at home and abroad have low bonding strength and are often modified by adding epoxy resin or phenolic resin. For example, patent ZL03133623 (a kind of epoxy-modified silicone resin adhesive) adopts epoxy-modified silicone resin as base glue and low molecular weight polyamide as curing agent, but the process is more complicated and the cost is higher; document (application number 200610068263.1 ring Oxygen-silicone hybrid resin composition and its manufacturing method, and light-emitting semiconductor device) introduces organohydrogen polysiloxane, aromatic epoxy resin or hydrogenated epoxy resin, adopts platinum series or aluminum serie...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J11/06C09K3/10C09J163/00
Inventor 许家瑞尹以高张艺陈晓燕池振国
Owner SUN YAT SEN UNIV
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