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Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method

A technology of epoxy resin solution and chemical copper plating, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as electrical performance change, achieve high flatness, good stability and good quality Effect

Inactive Publication Date: 2015-07-22
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a configuration method of an self-catalyzed active electroless copper plating epoxy resin solution that can be used in printed circuit board manufacturing technology and a method for using the solution to carry out electroless copper plating. The solution can effectively solve the problem of activation The problem of poor bonding between the layer and the original substrate can effectively avoid the cost increase caused by the use of doped active resin on the entire substrate, changes in the electrical properties of the substrate, ion migration and other technical problems

Method used

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  • Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method
  • Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method
  • Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method

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Experimental program
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Effect test

Embodiment 1

[0028] The configuration method of the self-catalyzed electroless copper plating epoxy resin solution of this example comprises the following steps:

[0029] 1. Prepare a new active agent solution.

[0030] (1) Weigh 0.1-0.5 g of active ion source, while stirring, add the active ion source into a beaker filled with 10-20 mL of organic solvent, and fully stir to form a uniform active agent solution;

[0031] The active ion source refers to a metal salt that can form catalytic electroless copper plating particles after being reduced, and the active ion source includes organic acid salts, metal carbonyl compounds, metal alkoxides, and acetylacetone complexes soluble in organic solvents. One or more active ion sources specifically include palladium acetate, palladium oxalate, silver benzoate, silver acetate, silver oxalate, copper formate, copper acetate, copper oxalate, copper carbonyl, silver carbonyl, copper alkoxide, silver alkoxide, One or more of copper acetylacetonate or s...

Embodiment 2

[0048] 1. Weigh 0.1g of copper formate and add it into a butanone-ethylene glycol (1:1) system with a mass of 3g, wherein the volume ratio of butanone-ethylene glycol is 1:1, stir well to make it evenly mixed , and a small amount of ethylenediamine was added dropwise as a dispersant, and an epoxy resin curing catalyst was added dropwise, and stirred evenly.

[0049] 2. Take 1 g of bisphenol A glycidyl ether, add 0.8 g of methyl hexahydrophthalic anhydride, and stir mechanically for 20 minutes to form a glycidyl ether epoxy resin solution.

[0050] 3. Use a dropper to slowly drop the copper formate-butanone / ethylene glycol solution obtained in step 1 into the stirred glycidyl ether epoxy resin solution, and continue stirring for 30 minutes after the drop is completed to obtain a copper-containing epoxy resin solution .

[0051] 4. Select the FR-4 substrate as the substrate of the printed circuit board, ultrasonically clean the FR-4 substrate with absolute ethanol and deionized...

Embodiment 3

[0056] 1. Weigh 0.1g of silver acetate, add it to 3g of methyl ethyl ketone, stir well to make it evenly mixed, and drop a small amount of ethylenediamine as a dispersant, add dropwise an epoxy resin curing catalyst, and stir evenly.

[0057] 2. Take 1 g of bisphenol A glycidyl ether, add 0.8 g of methyl hexahydrophthalic anhydride, and stir mechanically for 20 minutes to form a glycidyl ether epoxy resin solution.

[0058] 3. Use a dropper to slowly drop the solution obtained in step 1 into the epoxy resin solution obtained in step 2 under stirring, and continue stirring for 30 minutes after the drop is completed to obtain a silver-containing epoxy resin solution.

[0059] 4. Clean the FR-4 substrate ultrasonically with absolute ethanol and deionized water, bake it in an oven at 100°C for 1 hour, and apply the silver-containing epoxy resin solution in step 3 evenly and thinly on the dry FR-4 substrate. 4 on the substrate, and put it in an oven at 130°C for 10 minutes to cure....

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Abstract

The invention relates to a compounding method of an epoxy resin solution with autocatalysis chemical copper plating activity and a chemical copper plating method, and belongs to the technical field of material surface treatment. The compounding method comprises the following steps: adding an activity ion source to an organic solvent under the circumstance of unceasingly stirring, adding a given number of curing catalysts, and sufficiently stirring the activity ion source, the organic solvent and the curing catalysts so as to form a uniform active agent solution; adding epoxy resins to a curing agent according to a certain proportion in a stirring manner so as to form an epoxy resin organic solution; unceasingly stirring the epoxy resin organic solution, and besides, slowly adding the active agent solution to the epoxy resin organic solution so as to form a uniform stable system, namely obtaining a chemical copper plating epoxy resin solution with autocatalysis activity; enabling a compounded resin solution to form a uniform coating on a basal board of a printed circuit board by a casting method or a silk screen printing method, and performing the procedures of solidification, microetch, reduction, chemical plating and the like so as to obtain a plating piece with a bright pink copper plating layer. Through performance test, the copper layer-resin binding force and the electrical conductivity of samples are excellent, and the compounding method and the chemical copper plating method are suitable for a chemical copper plating technology.

Description

technical field [0001] The invention belongs to the technical field of material surface treatment, and relates to a configuration method of an activator for electroless copper plating on a printed circuit board and a method for using it to perform electroless copper plating, in particular to an epoxy resin solution with self-catalyzed electroless copper plating activity The configuration method and the method for electroless copper plating using it. Background technique [0002] In the manufacturing process of printed circuit board (PCB) conductive circuit, electroless plating and electroplating technology are mainly used to realize additive circuit production and hole metallization. The principle is to first deposit a thin layer of copper in the micropores or on the surface of the PCB substrate through electroless copper plating to make it conductive, and then use electroplating technology to thicken it to obtain the target electronic circuit or realize the metallization of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30C23C18/40
Inventor 何为成丽娟王守绪周国云何雪梅陈苑明陈国琴
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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