Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating

A printed circuit and electroless copper plating technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems such as difficult to realize the preparation of thick copper wires, poor conductivity of conductive patterns, easy shrinkage and deformation of wires, etc., to achieve improved Good conductivity and practicability, good density and uniformity, and good conductivity

Active Publication Date: 2013-12-25
遂宁迪印科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen that the common problems of the above technologies are that it is difficult to realize the preparation of thick copper wires, and the prepared conductive patterns have poor conductivity characteristics (high resistivity)
Process Idea 1 Due to the limitation of the printing process, the thickness of the ink is limited, and when the thickness of the

Method used

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  • Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating
  • Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating
  • Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating

Examples

Experimental program
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Effect test

specific Embodiment approach 1

[0027] Catalyst for electroless copper plating with copper:

[0028] Dissolve 0.016mol of copper sulfate in 44mL of deionized water, then add 1mL of glycerin and 5mL of isopropanol to adjust the viscosity of the solution to 2.1mPa·s and the surface tension to 32mN / m to obtain copper ion ink; 0.03mol of sodium hydroxide Dissolve in 35mL deionized water, then dissolve 0.034mol sodium borohydride in the above sodium hydroxide solution, then add 5mL glycerol and 10mL isopropanol to adjust the solution viscosity to 2.3mPa·s and surface tension to 30mN / m, namely Get reducing agent ink. Load the two inks into the printer's two ink cartridges, and the printer is ready to go.

[0029] The polyimide (PI) substrate was washed with water and dried to prepare a substrate pretreatment solution, which contained: 1.5 mol / L sodium hydroxide, 0.2 mol / L sodium carbonate, and 0.03 mol / L trisodium phosphate. It has both degreasing and roughening effects on polyimide substrates. Heat the solution...

specific Embodiment approach 2

[0033] Catalyst for electroless copper plating with silver:

[0034] Dissolve 0.02 mol of silver nitrate in 30 mL of deionized water, then add 10 mL of ethanol, 5 mL of ethylene glycol and 5 mL of n-propanol to adjust the viscosity of the solution to 2.7 mPa·s and the surface tension to 32 mN / m to obtain a silver ion catalytic ink. Ink is loaded into the printer cartridges and the printer is ready to go.

[0035] The polyimide base material is selected and processed according to the method in Embodiment 1, and the silver ion ink is printed on the base material, and then treated after curing to be plated.

[0036] Prepare the first step copper plating solution, wherein the concentration of each component is: copper sulfate 0.04mol / L, aminotriacetic acid 0.16mol / L, sodium hydroxide 0.25mol / L and formaldehyde 0.16mol / L, 2-mercaptobenzothiazole 10mg / L, the pH of the plating solution is 13, heat the constant temperature plating solution in a water bath at 45°C, immerse the substra...

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Abstract

The invention relates to a printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating, and belongs to the field of printed electronic technologies. Firstly, prepared catalysis ink is printed on the surface of a substrate to form a catalytic activity circuit image, then, the substrate with the catalytic activity circuit image is immersed in an chemical copper plating solution (containing a high compounding agent) in the first step and undergoes first-step chemical copper plating to form a copper autocatalysis active layer (a copper nano-cluster structure), at last, the substrate with the copper autocatalysis active layer on the surface is immersed in a chemical plating solution (containing a small amount of high compounding agent and an excessive amount of low compounding agent) in the second step and undergoes second-step chemical copper plating, finally the target printed circuit is obtained, the thickness of a copper player is over 20 micrometers, and the electrical resistivity is within the range of 10<6>-10<5>omega.cm. A chemical plating process is directly used for preparing the thick copper conductor layer without electroplating thickening, the process is simplified, cost is lowered, and the prepared printed circuit is good in electrical conductivity. The manufacturing method can be used for manufacturing of printed-circuit boards, radio frequency antennas and other conducting circuits.

Description

technical field [0001] The invention belongs to the technical field of Printed Electronics, and in particular relates to a low-cost and environment-friendly additive preparation method for printed circuits based on nickel catalysis and electroless copper plating. The invention can be used to prepare patterned conductive circuits in products such as printed circuit boards (PCBs), LED substrates, mobile phone antennas, and radio frequency tag (RFID) antennas. Background technique [0002] As an important part of the circuit system, conductive lines mainly provide signal and power connections for electronic components, components, and integrated modules. The traditional preparation process based on hard-based (rigid PCB, ceramic-based) and soft-based (flexible PCB) conductive circuits is based on the "subtractive method", mainly using copper-clad laminate mask etching process, which has a long process flow and environmental pollution problems. more serious. In recent years, t...

Claims

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Application Information

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IPC IPC(8): H05K3/18
Inventor 冯哲圣程伟陈金菊李金彪杨超
Owner 遂宁迪印科技有限公司
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