Pore structure for tin-bead-resistant printed template
A technology of printing stencil and opening structure, applied in the direction of printed circuit components, etc., can solve the problems of hidden product quality, small spacing, short circuit of components, etc., and achieve the effect of improving welding stability, simple structure and reasonable design.
Inactive Publication Date: 2014-05-07
昆山元崧电子科技有限公司
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Problems solved by technology
The diameter of solder balls is roughly between 0.2mm and 0.4mm, and there are also those that exceed this range. The existence of solder beads not only affects the appearance of electronic products, but also poses hidden dangers to the quality of products.
[0005]Due to the high density and small spacing of modern printed board components, solder beads may fall off during use, causing short circuits in components and affecting the quality of electronic products
Method used
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Embodiment
[0017] see figure 1 , what this embodiment provides is a kind of anti-tin bead printing template opening structure, and it comprises a template, and what this template adopts is steel plate 1, and this steel plate 1 is the tool required for printing products in the SMT printing process, is set on steel plate 1 There are circular soldering openings 2. By changing the size and shape of the soldering openings 2 of the steel plate, the area and shape of the tin printing can be changed. The openings of the original steel plate are the size of the solder pads, and tin beads will be generated when the openings are made to change the size and shape of the tin plate. Plate openings and shapes improve solder ball generation.
[0018] The side wall of the solder opening 2 in this embodiment is a trapezoidal bump 3 with a trapezoidal cross-section. The middle part of the trapezoidal bump 3 is provided with an inner notch 4, and the inner wall of the inner notch 4 is inwardly facing. For ...
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The invention relates to a pore structure for a tin-bead-resistant printed template. The pore structure provided by the invention is characterized by comprising a template, wherein a tin soldering pore is formed on the template; the side wall of the tin soldering pore is a trapezoid bump with cross section in a trapezoid shape; the middle part of the trapezoid bump is provided with a concave opening; and the inner wall of the concave opening is a concave arc-shaped edge. In the pore structure provided by the invention, the pore of the template is designed to be less than the actual dimension of a soldering disk; the area and shape of the printed tin are changed by changing the dimension and shape of a pore on a steel plate; the problem that a high-end product generates tin beads in manufacturing procedures is solved by forming a tin soldering pore of the trapezoid bump; the damage of an electronic product because of the falling of tin soldering beads is avoided; the pore structure has the advantages of reasonable design and simplicity in structure; and the stability of soldering is improved.
Description
technical field [0001] The invention relates to an SMT process steel plate engraving process, in particular to an anti-tin bead template opening structure for printed products in the SMT printing process. Background technique [0002] With the continuous miniaturization and diversification of functions of SMT components, especially the rapid development of passive components (for example, 0201 components with a pitch of 0.1mm are currently being used and 01005 components that are expected to be used in advanced placement by 2005 Dimensional chip components), so that the design and manufacture of the formwork is more and more at the forefront. It is the first step in determining whether a new component can be widely used in the production line. Whether chemical etching, laser cutting, hybrid, or electroforming are used to process the stencil, the purpose is to obtain high-quality printing effects and control the generation of solder balls through stencil printing. In order ...
Claims
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IPC IPC(8): H05K1/02
Inventor 陈敬光
Owner 昆山元崧电子科技有限公司