Rotary sensor
A technology for rotating sensors and rotating bodies, which is applied in the direction of using electric/magnetic devices to transmit sensing components, measuring device casings, etc., which can solve problems such as increased assembly processes and damage to integrated circuits 104, and achieve the suppression of deviations in internal dimensions and structure Effects of simplification, detection accuracy and reliability
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Embodiment approach 1
[0129] Figure 1 ~ Figure 3 It is a sectional view showing the rotation sensor according to Embodiment 1 of the present invention. image 3 is from figure 2 A cross-sectional view of a state in which the lead frame 3Y is viewed from the direction of the arrow III. In addition, in each figure, hatching of the lead frames 3X and 3Y is omitted and shown (the same applies to Embodiment 2 and later).
[0130] exist Figure 1 ~ Figure 3 Among them, the rotation sensor 1 of Embodiment 1 includes: a casing (bottomed casing) 2; a pair of lead frames (terminals) 3X, 3Y; an integrated circuit 4 as a magnetic detection device; a magnet 5 in the sensor; Lines 6X, 6Y. The integrated circuit 4 , the magnet 5 in the sensor, and the pair of metal wires 6X and 6Y are integrated by molding resin to form a magnetic detection unit (rotation detection unit) 7 . The integrated circuit 4 includes: a detection element as a Hall element, for example; and a signal processing circuit (both are not ...
Embodiment approach 2
[0165] In Embodiment 1, in the first step, the magnetic detection portion 7 is directly formed on the lead frames 3X and 3Y. On the other hand, in Embodiment 2, detection of lead frames 3X, 3Y of Embodiment 1, connector-side lead frames 23X, 23Y on which positioning portions 23Xe, 23Ye are formed, and magnetic detection portion 7 including integrated circuit 4 is formed. The part-side lead frames 24X and 24Y are manufactured in different steps. In addition, the connector side lead frames 23X, 23Y and the detection unit 25 including the magnetic detection unit 7 and the detection unit side lead frames 24X, 24Y are manufactured in a different process. Here, the difference from the first step of Embodiment 1 will be mainly described.
[0166] Figure 13 to Figure 17 It is an explanatory diagram for explaining one step of the manufacturing process of the rotation sensor according to Embodiment 2 of the present invention. First, if Figure 13 As shown, similarly to Embodiment 1...
Embodiment approach 3
[0179] In Embodiment 1, the integrated circuit 4 has a detection element formed of a Hall element. In contrast, in Embodiment 3, the integrated circuit 34 has a detection element formed of an MR element (MR: magnetoresistive).
[0180] Figure 18 , Figure 19 It is a sectional view showing the rotation sensor according to Embodiment 3 of the present invention. Figure 19 is from Figure 18 A cross-sectional view of a state in which the lead frame 3Y is viewed in the direction of the arrow XIX. exist Figure 18 , Figure 19 In the lead frame 3Y of the third embodiment, an integrated circuit mounting surface 3Yb" is provided instead of the integrated circuit mounting surface 3Yb' of the first embodiment. The integrated circuit mounting surface 3Yb" is arranged to face the bottom surface 2a of the case 2 Orthogonal direction.
[0181] The integrated circuit 34 of Embodiment 3 is mounted on one surface of the integrated circuit mounting surface 3Yb″ ( Figure 19 on the rig...
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