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Grinding head and chemical mechanical grinding machine table

A grinding head, circular surface technology, applied in the direction of grinding machine tools, grinding devices, metal processing equipment, etc., can solve the problems of changing thickness difference, need to be improved, pressure regulation, etc., to improve grinding uniformity and improve pressure control accuracy , the effect of improving uniformity

Inactive Publication Date: 2011-12-28
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Each wafer includes multiple exposure units (shots), and the pattern between each shot on the entire wafer is the same, that is, the wafer is divided into several shots with a periodic structure, and one shot includes multiple grains ( die), in the prior art, a region of the grinding head may cover multiple dies of the wafer. When there is a difference in the thickness of one or more dies in the region, the grinding head cannot adjust the pressure for each die, thus Change the thickness difference, that is to say, the grinding uniformity of the grinding head in the prior art still needs to be improved

Method used

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  • Grinding head and chemical mechanical grinding machine table
  • Grinding head and chemical mechanical grinding machine table
  • Grinding head and chemical mechanical grinding machine table

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Embodiment Construction

[0017] In order to make the object, technical solution, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0018] The core idea of ​​the present invention is: the surface of the grinding head is divided into at least more than 5 relatively independent areas, each area is controlled by a corresponding pneumatic device, and the surface of the grinding head corresponds to the surface of the wafer, so that the surface of the grinding head can be controlled to be applied to smaller areas on the wafer. The pressure in the area improves the pressure control accuracy per unit area on the wafer, and further improves the uniformity of wafer grinding.

[0019] The first embodiment of the present invention draws concentric circles with the center of the circular surface of the grinding head as the center, divides the circular surface into more than 5 regions, and the en...

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Abstract

The invention provides a grinding head, the surface in contact with the wafer is circular, and the circular surface has more than 5 relatively independent areas, each area is connected with a corresponding pneumatic device, and the pneumatic device is used for each grinding head. Zones provide pressure. The present invention also provides a chemical mechanical polishing machine platform comprising the above-mentioned polishing head. The adoption of the device of the invention effectively improves the uniformity of grinding wafers.

Description

technical field [0001] The invention relates to the field of chemical mechanical grinding, in particular to a grinding head and a chemical mechanical grinding machine platform. Background technique [0002] At present, with the wide application of electronic devices, the manufacturing process of semiconductors has been developed rapidly. In the manufacturing process of semiconductors, a chemical mechanical polishing process (CMP) is involved. Wafer (wafer) planarization process is completed relying on chemical mechanical polishing machine, chemical mechanical polishing machine can be used for grinding various materials, such as polysilicon, copper, tungsten, shallow trench isolation (STI), Grinding of interlayer dielectric layer (ILD) or intermetal dielectric layer (IMD), etc. Schematic diagram of the cross-sectional structure of the existing chemical mechanical grinding machine, such as figure 1 shown. The machine includes a grinding table 101 , a grinding pad (pad) 102 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00
Inventor 邓武锋
Owner SEMICON MFG INT (SHANGHAI) CORP
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