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High speed, low power consumption, isolated analog CMOS unit

A semiconductor and main body technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as slow switching, and achieve the effect of low cost and simple process steps

Inactive Publication Date: 2013-12-25
FAIRCHILD SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high-threshold voltage devices switch more slowly than low-threshold

Method used

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  • High speed, low power consumption, isolated analog CMOS unit
  • High speed, low power consumption, isolated analog CMOS unit
  • High speed, low power consumption, isolated analog CMOS unit

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0018] figure 1 and figure 2 An exemplary embodiment of the invention is illustrated in. The figure shows an integrated high threshold voltage CMOS device 100 with an additional control gate 120. The PMOS transistor includes a high threshold voltage (htv) transistor 110 and a low voltage threshold (ltv) transistor 112. The NMOS transistor includes a high threshold voltage transistor 114 and a low threshold voltage transistor 116. The source of the ltv transistor 112 is connected to the drain of the htv transistor 110 and the drain of the ltv transistor 112 forms the output terminal 122 of the device. The source of the ltv transistor 116 is connected to the drain of the htv transistor 114 and the drain of the ltv transistor 116 forms the output terminal 122 of the device. The gates of the transistors 112 and 116 are connected together at the input terminal 121. The control gate 120 is connected to the gate of the htv PMOS transistor 110 and to the gate of the htv NMOS trans...

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PUM

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Abstract

A semiconductor device 100 has N-well regions 18 holding PMOS devices 110, 112 and P-type regions 14 holding NMOS devices 114, 116. Devices 110 and 114 have high thresholds and devices 112 and 116 have low thresholds. The PMOS devices are junction isolated from the substrate 10 by the N-well 18 and the NMOS devices are isolated from the substrate by the N-type layer 13. Field oxide regions 20 laterally isolate the PMOS from the NMOS devices. The high threshold CMOS devices 110, 114 connect the low threshold CMOS devices to opposite rails Vdd and Vss. A control terminal 121 turns the high threshold devices on to let the low threshold devices switch rapidly. In stand-by mode, the high threshold devices are off and there is very low leakage current.

Description

[0001] Cross reference to related applications [0002] This application claims the benefit of the priority date of US Patent Application No. 12 / 365,228 filed on February 4, 2009, and the specification of the patent application is hereby incorporated by reference. Background technique [0003] MOSFET technology can be used to make high-speed and low-power consumption circuits for mobile, computing, communications and consumer products. However, the requirements for handling high speed and low power consumption usually require a basic compromise. In mobile applications such as cellular phones, high speed and low power consumption are key criteria. Generally, optimizing one criterion will negatively affect another criterion. A low threshold voltage (the voltage between the source and gate of the MOSFET, when it appears, the current first starts to flow in the transistor) is always preferred for high-speed MOSFETs. The relatively high threshold voltage reduces the MOSFET off-state ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L21/336
CPCH01L29/66659H01L21/823807H01L21/823814H01L29/1087H01L29/456H01L29/1045H01L29/0847H01L21/823878H01L21/823892H01L29/1083H01L27/0922H01L29/7835
Inventor 蔡军
Owner FAIRCHILD SEMICON CORP