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Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same

A technology of epoxy glass fiber cloth and epoxy resin, which is applied in the direction of circuit substrate materials, synthetic resin layered products, glass/slag layered products, etc., to achieve the effects of reducing Tg, improving flexibility, and good flexibility

Active Publication Date: 2012-01-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the copper clad laminate industry, there is no patent report on the combination of biphenyl epoxy resin and phenolic epoxy resin.

Method used

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  • Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same
  • Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same
  • Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Biphenyl type epoxy resin, 100 parts by weight;

[0042] Dicyandiamide (electronic grade) 3.94 parts by weight;

[0043] Phenoxy epoxy, 10 parts by weight

[0044]2-methylimidazole, 0.03 parts by weight.

Embodiment 2

[0046] Biphenyl type epoxy resin, 100 parts by weight;

[0047] Dicyandiamide (electronic grade), 3.94 parts by weight;

[0048] Phenoxy epoxy, 20 parts by weight

[0049] 2-methylimidazole, 0.03 parts by weight.

Embodiment 3

[0051] Biphenyl type epoxy resin, 100 parts by weight;

[0052] Dicyandiamide (electronic grade), 3.94 parts by weight;

[0053] Phenoxy epoxy, 60 parts by weight

[0054] 2-methylimidazole, 0.03 parts by weight.

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PUM

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Abstract

The invention relates to a thermosetting epoxy resin composition and an epoxy fiberglass cloth-based copper clad laminate prepared from the same. The thermosetting epoxy resin composition comprises components of biphenyl epoxy resin, phenoxy oxygen epoxy resin and a curing agent. The epoxy fiberglass cloth-based copper clad laminate prepared from the thermosetting epoxy resin composition comprises a plurality of mutually overlapped prepregs, and copper foils arranged on one side or two sides of the overlapped prepregs, wherein each prepreg comprises fiberglass cloth and the thermosetting epoxy resin composition which is subjected to impregnated drying and attached to the fiberglass cloth. In the thermosetting epoxy resin composition, the phenoxy oxygen epoxy resin is adopted as a flexibilizer, and when the phenoxy oxygen epoxy resin is matched with the biphenyl epoxy resin, good flexibility is achieved and the amplitude of reducing the glass transition temperature (Tg) of a prepared board can be reduced. The epoxy fiberglass cloth-based copper clad laminate prepared from the thermosetting epoxy resin composition has good flexibility and folding resistance, and the flexibility is obviously improved, so that the epoxy fiberglass cloth-based copper clad laminate can partially replace high-cost flexible copper clad laminate in places such as rigid-flex boards, static flexibility, parallel lifting and the like.

Description

technical field [0001] The invention relates to a thermosetting epoxy resin composition, in particular to a thermosetting epoxy resin composition and an epoxy glass fiber cloth-based copper-clad board made by using the thermosetting epoxy resin composition. Background technique [0002] With the miniaturization and multi-functional development of electronic equipment, high-density and high-performance PCBs are required. The design of electronic products is also increasingly considering special forms such as rigid-flex combination, parallel-elevated three-dimensional assembly, and static deflection. Under this premise, flexible boards and rigid-flexible boards have shown advantages. At present, the flexible parts of flexible boards and rigid-flexible boards use PI as a reinforced flexible circuit. Although the flexural performance is good, the cost is high and the price is expensive; The requirements of the song occasion caused a waste of performance. Under this premise, i...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/24B32B15/092B32B17/04B32B15/20B32B27/38C08K13/04C08K7/14H05K1/03
Inventor 邱宇星
Owner GUANGDONG SHENGYI SCI TECH