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Method for manufacturing flexible printed circuit board

A manufacturing method and circuit board technology, which are applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc., can solve the problems of high cost and labor, pollution of space environment, and low cost requirements, so as to save labor and reduce pollution. , the effect of reducing thickness

Inactive Publication Date: 2012-11-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Although the technology is constantly improving, the manufacturing process of flexible ink circuit boards is still limited by the ink screen printing operation, and it is difficult to make great progress; the traditional ink screen printing technology will bring extreme environmental damage due to the deployment and baking of ink. Heavy pollution, with the higher and higher requirements for environmental protection and lower and lower cost requirements, we must be required to develop new production processes to meet the needs of future development
[0003] The processing technology of the flexible ink circuit board is first to prepare the ink into a liquid state with a certain viscosity, and then use the silk screen printing process to operate. In this process, the volatilization of the solvent will cause serious pollution to the space environment. The disadvantages of printing are often missing and partial printing, and the pass rate will be affected; and the current silk screen printing technology often needs to be printed to a thickness of more than 15 μm to achieve a good covering effect, and the cost and labor are relatively high.

Method used

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  • Method for manufacturing flexible printed circuit board
  • Method for manufacturing flexible printed circuit board
  • Method for manufacturing flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: The carrier ink made of green oil (model: TG1, manufactured by Lvgu Company) is used to make a flexible ink circuit board

[0025] The ink layer thickness of the carrier ink is 7 μm, and the thickness of the carrier film is 50 μm. The window is opened by punching to make a mobile phone antenna board. The normal fast pressing method can achieve good ink transfer and line protection effect. The fast pressing temperature is : 180°C, time 100s, post-curing condition 150°C / 20min; make 20 boards respectively, use carrier ink to achieve 100% yield, use silk screen printing process to produce 2.3% missing printing, partial printing and other silk screen printing defect.

Embodiment 2

[0026] Embodiment 2: Using the carrier ink made of black oil (model: TG1, manufactured by Lvgu Company) to make a flexible ink circuit board

[0027] The ink layer thickness of the carrier ink is 7 μm, and the thickness of the carrier film is 50 μm. The window is opened by punching to make a mobile phone antenna board. The normal fast pressing method can achieve good ink transfer and line protection effect. The fast pressing temperature is : 180°C, time 100s, post-curing at 150°C / 20min; make 20 boards respectively, use carrier ink to achieve 100% yield, use silk screen printing process to produce 1.5% missing printing, offset printing, etc. Silkscreen defects.

[0028] In summary, the present invention changes the traditional screen printing ink process, adopts solid carrier ink, opens a window for the carrier ink, and peels off the carrier film of the carrier ink after alignment pressing and curing, so as to achieve ink protection for the area that needs to be protected, and ...

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PUM

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Abstract

The invention provides a method for manufacturing a flexible printed circuit board. The method comprises the following steps of: 1, providing carrier ink, wherein the carrier ink comprises a carrier membrane and an ink layer thereon; 2, windowing the carrier ink according to a circuit pattern of a circuit substrate; 3, aligning and adhering the windowed carrier ink to the circuit substrate in theway of making an ink layer face the circuit substrate, and pressing; 4, stripping the carrier membrane of the carrier ink, post-curing according to the curing condition of the ink, and performing surface treatment to obtain the flexible printed circuit board. Compared with the conventional method for manufacturing the flexible printed circuit board, the method provided by the invention has the advantages that: a silk screening process is eliminated, heat transfer of the ink can be realized by common quick pressing, and thus the thickness of the ink can be reduced; meanwhile, a good covering effect can be achieved, the utilization rate of the ink is improved, the cost is reduced, product yield is increased greatly, labor is saved, the production cycle is shortened, and environmental pollution is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a flexible ink circuit board. Background technique [0002] Although the technology is constantly improving, the manufacturing process of flexible ink circuit boards is still limited by the ink screen printing operation, and it is difficult to make great progress; the traditional ink screen printing technology will bring extreme environmental damage due to the deployment and baking of ink. Big pollution, with the higher and higher requirements for environmental protection and lower and lower requirements for cost, we must be required to develop new manufacturing processes to meet the needs of future development. [0003] The processing technology of the flexible ink circuit board is first to prepare the ink into a liquid state with a certain viscosity, and then use the silk screen printing process to operate. In this process, the volatilization o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
Inventor 王克峰
Owner GUANGDONG SHENGYI SCI TECH
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