Laser processing device of silicon glass bonding slice and method thereof

Abstract

The invention relates to a laser processing device of a silicon glass bonding slice and a method thereof. An output end of an ultraviolet high-frequency ultrashort pulse laser is provided with an optical gate, a beam expander and an aperture diaphragm, an output end of the aperture diaphragm is provided with a pair of 45-degree completely reflecting mirrors, output ends of the 45-degree completely reflecting mirrors are provided with deflection lenses, an output end of the deflection lens is provided with a 45-degree completely reflecting mirror, an output end of the 45-degree completely reflecting mirror is provided with a focus lens, the focus lens is right opposite to a three-dimensional movable platform, a CCD (Charge Coupled Device) illuminating lamp is arranged under the focus lens, and a coaxial CCD (charge coupled device) para-position observation system is distributed above the three-dimensional movable platform. Light beams sent by the ultraviolet high-frequency ultrashort pulse laser chemically focus a focal point on the upper surface of glass material, a spiral deflection lens controls the width of a once-cut cutting track, adjusts the cutting track into the cutting track with proper width, accurately positions the cut cutting track, and controls the focal point to correspondingly descend along with the increase of the cutting depth to orderly cut each cutting track on the silicon glass bonding slice.

Description

technical field [0001] The invention relates to equipment and a method for cutting a silicon-glass bonding sheet with an ultraviolet high-frequency ultrashort-pulse laser, and belongs to the technical field of laser micromachining. Background technique [0002] At present, the method of cutting silicon-glass bonding sheets is mainly diamond wheel cutting. Diamond cutting can cut materials such as glass and silicon. However, when using a diamond grinding wheel for processing, cutting fluid needs to be sprayed, which seriously pollutes the surface of high-purity silicon; the diamond grinding wheel is in direct contact with the bonding sheet, and the stress is likely to cause damage to the surrounding core electrical functional devices; the grinding wheel is also easy to block, requiring frequent It costs a lot to replace the grinding wheel and cutting fluid; the bonding chip breakage rate is high during cutting. [0003] Laser cutting technology is defined as a material proc...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a device and method for cutting silicon-glass bonded sheets by ultraviolet high-frequency ultrashort-pulse laser, aiming to overcome the low processing efficiency and easy production of For defects such as pollution and easily damaged devices, use ultraviolet high-frequency ultra-short pulse laser to cut silicon-glass bonding sheets

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