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Pulse laser cutting method for fragile materials

A pulsed laser, brittle material technology, used in laser welding equipment, metal processing equipment, welding equipment, etc., to achieve the effect of simplifying processing procedures, low laser energy, and fast cutting speed

Inactive Publication Date: 2012-01-18
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above article only analyzes metal materials, and the completion of cutting metal materials under the condition of linearly polarized laser scanning still requires high-energy lasers to form continuous ablation areas on the material surface

Method used

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  • Pulse laser cutting method for fragile materials
  • Pulse laser cutting method for fragile materials
  • Pulse laser cutting method for fragile materials

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Embodiment Construction

[0016] In the following, the cutting steps of the present invention will be described in detail by taking cutting a brittle ceramic plate-shaped material with a thickness of 0.5 mm as an example in conjunction with the accompanying drawings.

[0017] The inventive method finishes in the pulse laser cutting system to the processing of 0.5mm brittle ceramic plate material, see figure 1 , the system is composed of a pulse laser 1, a mirror 2, a focusing lens 3, an electric translation stage 5 and a computer 4. Its specific implementation steps are as follows:

[0018] Step 1: Fix the 0.5mm brittle ceramic plate to be cut on the electric translation table in the pulse laser cutting system;

[0019] Step 2: Start the pulse laser cutting system, and use the computer to adjust the single pulse energy and laser frequency in the range of 0.5J to 80J and 0 to 100Hz. In this example, the laser energy is adjusted to 2J, the laser frequency is 10Hz, and the pulse width is 1 millisecond. ...

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Abstract

The invention discloses a pulse laser cutting method for fragile materials, which utilizes a device comprising a pulse laser with a pulse width of millisecond level, a computer, an electric horizontal moving platform and the like to cut a fragile plate-like material. By utilizing the characteristics that linearly polarized laser can form long and narrow ablated areas on the surface of the material and that the fragile material can be easily broken, the pulse laser cutting method forms uncrossed long and narrow ablated areas distributed at intervals on the surface of the fragile plate-like material along the scanning direction, then utilizes the stress of both ends of each ablated area to break the material, and connects the neighboring ablated areas together, and thereby cutting is finished. Since the pulse laser cutting method adopts the long and narrow ablated areas formed by the linearly polarized laser, the waste of the material can be reduced, the ablated areas are cut when the material is broken, fracture surfaces are smooth, and the cutting quality is high; the ablated areas are distributed at intervals, and do not need to be crossed by one another, the needed laser energy is little, the cutting speed is high, and the pulse laser cutting method can be widely applied to the cutting of glass, ceramics, semiconductors and other fragile plate-like materials.

Description

technical field [0001] The invention relates to a laser cutting method, in particular to a method for completing fracture cutting of plate-shaped brittle materials according to the thermal stress induced in the process of linearly polarized laser irradiating brittle materials. Background technique [0002] Most of the existing laser cutting technologies for brittle materials use continuous lasers to scan the surface of brittle plate-shaped materials along a straight line, and use the high-density energy generated by the laser beam to be focused by the lens to melt or even gasify the material in a short time, and then The slag is blown off with auxiliary gas blowing, and then the kerf is completed by moving the laser beam to form a continuous ablation area. This type of laser cutting method mostly uses circularly polarized laser to form a continuous ablation area to fuse the material. The laser energy required in the process is large, and there are disadvantages such as slow ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/38
Inventor 倪晓武刘剑秦渊沈中华陆建
Owner NANJING UNIV OF SCI & TECH
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