The invention discloses a pulse
laser cutting method for fragile materials, which utilizes a device comprising a pulse
laser with a pulse width of
millisecond level, a computer, an electric horizontal moving platform and the like to
cut a fragile plate-like material. By utilizing the characteristics that linearly polarized
laser can form long and narrow ablated areas on the surface of the material and that the fragile material can be easily broken, the pulse
laser cutting method forms uncrossed long and narrow ablated areas distributed at intervals on the surface of the fragile plate-like material along the scanning direction, then utilizes the stress of both ends of each ablated area to break the material, and connects the neighboring ablated areas together, and thereby
cutting is finished. Since the pulse
laser cutting method adopts the long and narrow ablated areas formed by the linearly polarized laser, the waste of the material can be reduced, the ablated areas are
cut when the material is broken, fracture surfaces are smooth, and the
cutting quality is high; the ablated areas are distributed at intervals, and do not need to be crossed by one another, the needed laser energy is little, the cutting speed is high, and the pulse
laser cutting method can be widely applied to the cutting of glass, ceramics, semiconductors and other fragile plate-like materials.