Metal plate low resistance chip resistor, and production method for the same

A metal resistance and manufacturing method technology, applied in non-adjustable metal resistors, resistance manufacturing, resistors, etc., can solve the problems of complicated adjustment process and inability to cope, and achieve high reliability and prevent overheating.

Active Publication Date: 2012-01-18
KAMAYA ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, there are many requests for thinner parts, but such requests from customers cannot b

Method used

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  • Metal plate low resistance chip resistor, and production method for the same
  • Metal plate low resistance chip resistor, and production method for the same
  • Metal plate low resistance chip resistor, and production method for the same

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Embodiment Construction

[0057] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

[0058] figure 1 (a) is a top view of the metal plate low-resistance chip resistor 10 of the present invention, figure 1 (b) is a sectional view cut along line B-B, figure 1 (c) is a sectional view cut along line C-C, figure 1 (d) is a plan view of the metal resistance plate 11 constituting the metal plate low-resistance chip resistor 10 . In the metal plate low-resistance chip resistor 10 , electrode films 12 are formed on the front and back surfaces of both ends of a metal resistance plate 11 made of an alloy, and a protective film 13 is formed between the electrode films 12 at both ends.

[0059] Here, the above-mentioned metal resistance plate 11 is as figure 1 As shown in (d), in the rectangle formed by the side 11a and the end side 11b, the approximate center of the two sides 11a is notched, and through the notc...

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Abstract

Provided is a metal plate low resistance chip resistor which has a resistance value of about 15 to 50 mO, high reliability, and a lower back. Also provided is a production method that can produce the metal plate low resistance chip resistor with a high degree of accuracy and at a high yield using a relatively simple process. A metal plate low resistance chip resistor (10) includes a metal resistance plate (11), electrode films (12) formed on both ends of the metal resistance plate, and a protective film (13) formed between the electrode films. Both sides (11a) of the rectangular metal resistance plate are cut off at predetermined positions to form the shape of the metal resistance plate. On both edge sections (11d) of the metal resistance plate, the electrode films (12) are formed near one edge side and the other edge side, respectively. An area where there is no electrode film on the metal resistance plate is provided as a resistance section. In the resistance section, there is a portion both sides of which remains without being cut off, and the portion serves as a resistance value adjustment section (11f). There is a portion both sides of which are cut off, and the portion serves as a resistance value fixed section (11e). The surface of the metal resistance plate is covered with the protective film. The protective film extends over both sides of the resistance value fixed section. Therefore, the width of the protective layer is the same as that of both edge sections.

Description

technical field [0001] The present invention relates to a metal plate low-resistance chip resistor, and a method for realizing its resistance value with high and high precision. Background technique [0002] Conventionally, low-resistance chip resistors in which electrode films are formed on both ends of a plate-shaped metal resistor made of an alloy have been used. In such metal plate low-resistance chip resistors, it is required to realize a relatively high resistance value of 15 to 50 mΩ with high precision. [0003] As a method of manufacturing a metal plate low-resistance chip resistor, as described in Patent Document 1, for example, there is a method in which a copper plate as an electrode and a resistive metal plate are formed by etching or punching with a metal mold. Joining by spot welding and encapsulation by transfer molding. However, since the resistive metal plate and the copper plate as electrodes are spot-welded and packaged by transfer molding, it is diffic...

Claims

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Application Information

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IPC IPC(8): H01C17/00H01C3/00
CPCH01C17/006H01C7/003H01C7/001H01C17/245H01C3/00H01C17/00
Inventor 平野立树
Owner KAMAYA ELECTRIC
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