Preparing device of cell sheet for cold and hot regulation of temperature sensitive gel by utilizing semiconductor refrigerating sheets
A temperature-sensitive gel and a technology for preparing a device, which are used in tissue cell/virus culture devices, biochemical equipment and methods, biochemical instruments, etc. Long time and other problems, to achieve the effect of simple and reliable preparation device, reducing cell damage, and timely monitoring and improving
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Embodiment 1
[0021] Depend on figure 1 with 2 It can be seen that in this embodiment, the fixed frame (1) and the controller (6) are integrated, and all wires are integrated in the device, which has a compact structure. When the bottom area of the culture vessel (3) is small and the required cooling capacity is not large, a hollow hole (9) is provided at the bottom of the fixed frame (1) to expose the bottom surface of the semiconductor cooling chip (2) to facilitate the use of air to dissipate heat.
Embodiment 2
[0023] Depend on image 3 It can be seen that in this embodiment, the fixed frame (1) and the controller (6) are integrated, and all wires are integrated in the device, which has a compact structure. When the bottom area of the culture vessel (3) is large and the required cooling capacity is large, the bottom of the fixed frame (1) is processed into heat sinks (10) to increase the heat dissipation area.
Embodiment 3
[0025] Depend on Figure 4 It can be seen that in this embodiment, the fixed frame (1) and the controller (6) are separated separately, and the semiconductor refrigerator (2) and the temperature sensor (5) are connected to the controller (6) through wires (11) and wires (12) respectively. , the cooling and heating of the semiconductor cooling chip (2) can be remotely controlled by the controller (6). The fixed frame (1) can not only adopt figure 1 with figure 2 The square shown can also be processed into a circle or other shapes when the culture vessel (3) is a circle or other shapes. When the bottom area of the culture vessel (3) is small and the required cooling capacity is not large, a hollow hole (9) is provided at the bottom of the fixed frame (1) to expose the bottom surface of the semiconductor cooling chip (2) to facilitate the use of air to dissipate heat.
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