Method for recovering tin and lead from waste printed circuit board and device for same
A technology for waste circuit boards and tin bars, applied in a method and the field of devices used therein, can solve the problems of low economic benefit, environmental pollution, large oil reagent consumption, etc., and achieve good economic benefit, avoid environmental pollution, and high purity Effect
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Embodiment 1
[0035] A device for recovering tin and lead from waste circuit boards, including a deplating tank, a diaphragm pump and an electrolytic tank, in which a titanium mesh is used as an anode and a tin bar is used as a cathode, and the deplating tank passes through the A diaphragm pump communicates with the electrolytic cell.
[0036] A method for reclaiming tin and lead from waste circuit boards using the above-mentioned device, the specific steps are:
[0037] Step (1), get the methanesulfonic acid solution 100ml of mass fraction 65%, DI water 120ml, the nitric acid solution 10ml of mass fraction 60%, and the tensio-active agent of 14g dispersant, 7g corrosion inhibitor, 8g, then mix Evenly, make nitric acid-sulfonic acid type solution, add in described deplating tank as deplating solution;
[0038] In step (2), the waste circuit board is washed with water, then placed in the stripping solution, and stripped at 20°C for 10 minutes. In the plating solution, tin exists in the for...
Embodiment 2
[0042] It differs from Example 1 in that: a method for reclaiming tin and lead from waste circuit boards using the above-mentioned device, in step (1), take 100ml of methanesulfonic acid solution with a mass fraction of 65%, 120ml of DI water, and Fraction 60% nitric acid solution 70ml, and 16g dispersant, 8g corrosion inhibitor, 9g surfactant, then mix uniformly to make nitric acid-sulfonic acid type solution;
[0043] In step (2), deplating was carried out at 60° C. for 20 minutes, and the deplating solution was stirred by bubbling compressed air during the deplating process;
[0044] In step (4), the clear liquid entering the electroplating tank is electrolyzed at a temperature of 35° C., the current density during electrolysis is 20 A / dm 2 , the deposition rate is 5 μm / min, and the voltage U is 11 V.
Embodiment 3
[0046] It differs from Example 1 in that: a method for reclaiming tin and lead from waste circuit boards using the above-mentioned device, in step (1), take 100ml of methanesulfonic acid solution with a mass fraction of 65%, 120ml of DI water, and Fraction 60% nitric acid solution 40ml, and 15g dispersant, 7.5g corrosion inhibitor, 8.5g surfactant, then mix uniformly to make nitric acid-sulfonic acid type solution;
[0047] In step (2), deplating was carried out at 40° C. for 15 minutes, and the deplating solution was stirred by bubbling compressed air during the deplating process;
[0048] In step (4), the clear liquid entering the electroplating tank is electrolyzed at 22°C, the current density during electrolysis is 15A / dm2, the deposition rate is 4μm / min, and the voltage U is 6V.
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