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Copper-zinc alloy electroplating bath and method of plating using same

A zinc alloy and compound technology, applied in thin material processing, transportation and packaging, etc., can solve the problems of high toxicity and heavy burden of cyanide-containing waste liquid treatment, etc., and achieve the effect of reducing surface roughness parameters

Inactive Publication Date: 2012-02-01
BRIDGESTONE CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since conventional plating baths contain a large amount of cyanide compounds, their toxicity has become a serious problem, and the burden of disposal of waste liquid containing cyanide compounds is also heavy.

Method used

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  • Copper-zinc alloy electroplating bath and method of plating using same
  • Copper-zinc alloy electroplating bath and method of plating using same
  • Copper-zinc alloy electroplating bath and method of plating using same

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Embodiment Construction

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail.

[0025] It is important that the copper-zinc alloy electroplating bath of the present invention contains at least one compound in the compound shown in following formula (I)~(III) as additive:

[0026]

[0027] R 2 -O-(R 1 -O) n -R 2 (II)

[0028] (Here, R 1 For lower alkylene, R 2 Is H or lower alkyl, weight average molecular weight is 10 3 ~10 5 . )

[0029] (Hereafter also referred to as "polyoxyalkylene derivative".)

[0030] Na-SO 3 -(CH 2 ) 3 -S-S-(CH 2 ) 3 -SO 3 -Na(III)

[0031] (bis(3-sulfopropyl)disodium disulphide, hereinafter also referred to as "SPS"). By using JGB, polyoxyalkylene derivatives or SPS as additives in the copper-zinc alloy electroplating bath, the spreading ability of the copper-zinc alloy plating film can be improved. In addition, as a polyoxyalkylene derivative, polyethylene glycol can be used preferably, for exa...

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Abstract

A copper-zinc alloy electroplating bath with which a copper-zinc alloy deposit can be formed with improved throwing power, and a method of plating using the electroplating bath. The copper-zinc alloy electroplating bath contains, as an additive, at least one compound selected from a group consisting of compounds represented by formulae (I) to (III). These additives may be used alone or in combination of two or more thereof. (In formula (II), R1 is a lower alkylene, R2 is H or a lower alkyl, and the weight-average molecular weight is 103 to 105).

Description

technical field [0001] The present invention relates to a copper-zinc alloy electroplating bath and a plating method using the same, in particular, to a copper-zinc alloy electroplating bath capable of forming a copper-zinc alloy plating film with improved spreading ability and to plating using the same method. Background technique [0002] At present, copper-zinc alloy plating is widely used industrially as decorative plating in order to impart a brassy metallic luster and tone to metal products, plastic products, ceramic products, and the like. However, since conventional plating baths contain a large amount of cyanide compounds, their toxicity has become a serious problem, and the burden of disposal of cyanide compound-containing waste liquid is also large. [0003] As related solutions, many copper-zinc alloy plating methods that do not use cyanide compounds have been reported so far. For example, continuous plating is a practical method for applying brass plating to a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/58
CPCC25D3/58Y10T428/12493C25D7/0607
Inventor 和田由纪子
Owner BRIDGESTONE CORP
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