64 results about "Zinc alloy electroplating" patented technology

An additive for an alkaline zinc or zinc alloy electroplating bath medium, the additive comprising a random co-polymer comprising the reaction product of: (i) one or more di-tertiary amines including an amide or thioamide functional group, and (ii) optionally, one or more saturated second di-tertiary amines and/or one or more second di-tertiary amines including an unsaturated moiety, with (iii) one or more saturated or unsaturated linking agents capable of reacting with said di-tertiary amines (i) and (ii), provided that, where all the linking agents are saturated, an unsaturated di-tertiary amine must he present. Preferably, the polymer has the general formula n(2x+2y+zE_p)j-.

The invention aims to provide a tin-zinc alloy electroplating method. The method is performed under the following conditions: plating bath temperature: 15-25 DEG C; plating solution stirring speed: 50-200m/min; and cathodic current density: 5-100A/dm2. The tin-zinc alloy electroplating method is obtained by selection of a plating bath temperature, a cathode current density and the like and the use of a specific tin-zinc alloy plating bath, and the tin-zinc alloy plating obtained using the method has strong corrosion resistance and reduced pollution, and is an ideal substitute for cadmium plating.

An object of the invention is to provide an electroplating solution composition capable of obtaining a plated film excellent in adhesiveness to a coated film and excellent in corrosion resistance without surface treatment. The present invention relates to an organic polymer composite zinc alloy electroplating solution composition containing: (A) 1 to 600 g/l of Zn ion, (B) 1 to 600 g/l of an iron-group-element ion, and (C) 0.1 to 200 g/l, in terms of W ion, of tungstic acid-based compound, and (D) 0.5 to 500 g/l of water-soluble or water-dispersible organic polymer compound having a number average molecular weight of 1,000 to 1,000,000.

The invention discloses a carrier brightener precursor for an alkaline zinc-plating or zinc alloy electroplating solution. The carrier brightener precursor is obtained by carrying out a one-time chemical reaction of a mixed amine of one amide functional group-containing ditertiary amine and one or more amide functional group-containing monotertiary amines. The invention also discloses a carrier brightener for the alkaline zinc-plating or zinc alloy electroplating solution. The carrier brightener is a random intercondensation polymer; and components participating copolycondensation mainly comprise the following two components: the carrier brightener precursor mixed amine and one or more bridging agents. The intercondensation polymer used as the carrier brightener of the alkaline zinc-plating or zinc alloy electroplating solution has quite good compatibility with a main brightening agent benzyl pyridinium-3-carboxylate which is widely used at present, dependence on sulfonated aromatic aldehyde can be reduced, on one hand, the tendency of blistering of a plating layer is overcome, an operating window is expanded, and at the same time, the dispersion property of the plating solution is relatively improved; and a high-brightness electroplating layer having high dispersibility and high covering power also can be obtained, and the plating layer has excellent spalling (foaming) resistant performance.

The invention discloses a nickel plating solution, which includes 90-150g/L nickel sulfate, 45-65g/L sodium chloride, 5-12g/L cobalt chloride, 80-130g/L sodium citrate, a 0.5ml/L neutral nickel brightener, and a 35ml/L neutral nickel prepared solution. The making method of the nickel plating solution consists of: for instance in preparation of 1L of the plating solution, adding 500ml of water, conducting heating to 70DEG C, adding 80-130g of sodium citrate, then adding 90-150g of nickel sulfate and 5-12g of cobalt chloride, stirring the materials evenly, performing dissolving to be clear, adding 45-65g of sodium chloride, and performing dissolving to be clear, then adding 35ml of the prepared solution and 0.5ml of the brightener, adding water to 1000ml, and adjusting the pH value to 6.5-7.0. The nickel plating solution provided by the invention can realize direct nickel plating on zinc, the plating layer is full, pure white, bright, and has little smell, also the defect of required operation on a cyanide copper plating layer during traditional zinc alloy nickel plating can be prevented. Thus, the sewage treatment is simple, the cost is saved and a more environment-friendly effect can be achieved.

The invention relates to a cyanide-free copper-zinc alloy electroplating solution and a preparation method thereof. The electroplating solution consists of the following components in percentage by weight: 1-60 percent of complexing agent, 0.3-10 percent of copper salt, 0.2-10 percent of zinc salt and the balance of water, wherein the general formula of the complexing agent is MxHyPnO(3n+1)Rz; M is any one or multiple in alkali metal ions and NH<4+>; R is acyl; the general formula of the copper salt is Cux/2HyPnO(3n+1)Rz; the general formula of the zinc salt is Znx/2HyPnO(3n+1)Rz; x, n and z are positive integers; y is 0 or a positive integer; x+y+z is equal to n+2. The cyanide-free copper-zinc alloy electroplating solution is prepared by mixing the complexing agent, the copper salt, the zinc salt and water, the complexing capacity of the complexing agent is high, the complexing constant of copper ions can be 10<26-27>, and the complexing agent is far superior to a conventional complexing agent in the prior art. The stability of the electroplating solution prepared from the complexing agent is greatly improved, the quality of the electroplating solution is high, when the cyanide-free electroplating solution is used for pre-plating, main salt metal ions in the electroplating solution are not subjected to a replacement reaction with a metal base material, a loose replacement layer structure is not formed, and the quality of the electroplating layer is greatly improved.

Disclosed is a cyanide-free copper-zinc alloy electroplating bath which can form a uniform and glossy plated layer having the desired composition in a large current density range, and a plating method using the same.

The copper zinc alloy electroplating bath contains a copper salt, a zinc salt, an alkali metal pyrophosphate or an alkali metal tartrate, and nitrate ions. The concentration of the nitrate ions is preferably 0.001 to 0.050 mol/L. Further, the pH of the copper-zinc alloy electroplating bath is preferably in the range of 8 to 14. Furthermore, in addition to the copper salt, the zinc salt, the alkali metal pyrophosphate and the nitrate ions, at least one selected from amino acids or salts thereof is preferably included, and histidine can be used favorably as the amino acid.

An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc or zinc alloy plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the zinc or zinc alloy plating layer; forming a chromic-ion-containing silane coupling agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

The present invention provides a zinc alloy electroplating method comprising applying a current through an alkaline zinc alloy electroplating bath comprising a cathode and an anode, wherein a cathode region including the cathode and an anode region including the anode are separated from each other by an anion exchange membrane, a catholyte contained in the cathode region is an alkaline zinc alloy plating liquid, and an anolyte contained in the anode region is an aqueous alkaline solution.

The invention provides a nano-composite electroplating solution. The nano-composite electroplating solution is prepared from, by concentration, 23-26 g/L of cuprous cyanide, 10-12 g/L of zinc cyanide, 43-51 g/L of sodium cyanide, 25-35 g/L of sodium carbonate, 10-20 g/L of sodium potassium tartrate tetrahydrate, 4-8 g/L of ammonium chloride, 1-4 g/L of nano SiO2 and the balance water. By adding the nano SiO2, the degree of polarization of the cathode is increased, and growth of Cu-Zn alloy grains is prevented, so that a coating is more refined and compact, the porosity of a deposited layer is decreased, the particle-reinforced metal-based composite coating is formed, and accordingly the corrosion resistance of the coating is improved. It is indicated through test results that the corrosion current of the coating is greatly decreased, and it is proved that the corrosion resistance of the nano-composite coating is obviously improved compared with a Cu-Zn alloy coating. The invention further provides a preparing method of the nano-composite electroplating solution and a zinc alloy electroplated part.

The invention discloses an electroplating method of a cyanide-free copper-zinc electroplating solution containing an ionic liquid. The electroplating method comprises the following steps: (1) preparation of the cyanide-free copper-zinc electroplating solution; (2) pretreatment of a stainless steel workpiece; (3) copper pre-plating; (4) copper-zinc alloy electroplating; and (5) after-treatment. The electroplating method provided by the present invention solves the problem of poor solubility between metal ions and the ionic liquid; the electroplating solution contains the ionic liquid additive and thus is non-toxic and pollution-free, and low in energy consumption; meanwhile, due to a relatively low quantity of the added ionic liquid, no production cost is increased; the electroplating method can be used within a relatively wide current density range; and a coating obtained through electroplating under a continuously increased current density is golden yellow, continuous and even, and compact, and further good in binding force with a substrate, and resistant to high temperatures and abrasion.

The invention discloses copper-zinc alloy electroplate liquid and an electroplating method thereof. The copper-zinc alloy electroplate liquid comprises 40-60 g/L of copper sulfate, 6-10 g/L of cupric pyrophosphate, 6-10 g/L of diammine dichloropalladium, 20-40 g/L of zinc sulfate, 20-30 g/L of potassium citrate, 5-10 g/L of amino acid, 4-8 g/L of saccharin and 10-15 g/L of sodium acetate. An electroplating layer obtained in an electroplating manner through the copper-zinc alloy electroplate liquid is free of cracks, and corrosion resistance and abrasion resistance are good.

The invention relates to a cyanide-free cuprous copper-zinc alloy electroplating solution, particularly a preparation and application method of the cyanide-free cuprous copper-zinc alloy electroplating solution. The invention aims to solve the problem in controllable coating components in the copper-zinc alloy electroplating process and the problem of high electric power consumption due to adoption of divalent copper in the existing cyanide-free technique. The cyanide-free cuprous copper-zinc alloy electroplating solution is prepared from a cuprous compound, zinc chloride, a cuprous non-cyanide complexing agent, an auxiliary complexing agent, a plating solution stabilizer, a brightening agent and sodium acetate. The cyanide-free cuprous copper-zinc alloy electroplating solution is used under the conditions of 30-75 DEG C and 0.1-3.0 A/dm<2> by using a ruthenium-titanium anode or copper-zinc alloy anode. The cuprous ions can be complexed selectively to control the copper/zinc ratio, and the cuprous ions adopted in the plating solution can lower the electric power consumption and is beneficial to saving the energy sources.

Objects of the present invention is to provide a zinc-based alloy electroplated film having a high corrosion resistance comparable to Zn—Cr alloy plating without containing chromium which gives a heavy environmental load, and a plated metal material using the same. The present invention relates to a zinc-based alloy electroplated film excellent in corrosion resistance containing (A) 30 to 96% by weight of zinc, (B) 2 to 20% by weight of an iron-group metal, and (C) 2 to 50% by weight of tungsten.

The invention discloses a rare-earth-yttrium-nickel-zinc-alloy electroplating solution and a preparation method thereof. The rare-earth-yttrium-nickel-zinc-alloy electroplating solution comprises 120-200 g/L of nickel sulfate, 15-30 g/L of zinc sulfate, 0.05-1 g/L of yttria, 10-20 g/L of sodium glycolate, 10-25 g/L of citric acid, 2-5 g/L of a stabilizing agent, and 3-8 g/L of a brightener. The are-earth-yttrium-nickel-zinc-alloy electroplating solution has good stability and high cathode current efficiency. The obtained electroplated layer is uniform in dispersion, beautiful in color, and good in compactness and corrosion resistance.

The invention discloses a rare-earth-cerium-copper-zinc-alloy electroplating solution and an electroplating method thereof. The rare-earth-cerium-copper-zinc-alloy electroplating solution comprises 10-80 g/L of copper sulfate, 4-60 g/L of zinc sulfate, 0.1-1 g/L of cerium dioxide, 4-40 g/L of amino acid, 100-200 g/L of sodium pyrophosphate, and 3-8 g/L of a brightener. The rare-earth-cerium-copper-zinc-alloy electroplating solution has good stability. An obtained electroplated layer has a beautiful color, compactness, and excellent corrosion resistance.