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Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same

A surface treatment, copper foil technology, applied in the field of copper clad laminates, to achieve the effect of enhancing adhesion

Inactive Publication Date: 2002-07-10
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] As described above, regarding the formation of the silane coupling agent layer on the anticorrosion layer (the anticorrosion layer comprising the zinc or zinc alloy layer on the copper foil and the chromate layer formed on the zinc or zinc alloy layer), It can be considered that none of the inventions takes into account the following factors: the combination of the silane coupling agent and the anti-corrosion layer, the surface condition of the anti-corrosion layer when the silane coupling agent is adsorbed, and the drying conditions, and there is no invention in the Maximize effect when using silane coupling agent

Method used

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  • Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same
  • Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same
  • Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same

Examples

Experimental program
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Embodiment 1

[0104] In Example 1, the surface treatment of the copper foil 2 was performed with the surface treatment device 3 . The copper foil 2 used was a roll of foil before surface treatment. exist figure 2 In the apparatus 3 shown, the copper foil 2 is unwound from a foil roll and travels through the surface treatment apparatus 3 in a circular fashion. A grade 3 copper foil having a nominal thickness of 35 µm was used as copper foil 2, thereby producing an electrolytic copper foil for use in the manufacture of printed wiring boards. In the following, the production conditions are described in connection with a plant having a number of tanks installed in series in succession. This embodiment will incorporate figure 1 (a) to illustrate.

[0105] The copper foil 2 unrolled from the foil roll is first sent to the pickling tank 4, which is filled with a dilute sulfuric acid solution at 30° C. with a concentration of 150 g / l. The copper foil was immersed therein for 30 seconds to rem...

Embodiment 2

[0115] In Example 2, the surface treatment of the copper foil 2 was performed with the surface treatment device 3 . The copper foil 2 used was a roll of foil before surface treatment. exist image 3 In the apparatus 3 shown, the copper foil 2 is unrolled from a foil roll and advanced through the surface treatment apparatus 3 in a circular manner. A grade 3 copper foil having a nominal thickness of 35 µm was used as copper foil 2, thereby producing an electrodeposited copper foil for use in the manufacture of printed wiring boards. The production conditions will be described below in connection with a plant having a number of tanks installed in series in succession. To avoid redundant description, only those parts that are different from the corresponding parts described in Embodiment 1 are described. Whenever possible, the same parts as in Example 1 are in image 3 are represented by the same numbers. This embodiment will be combined with a section showing a cross-section...

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Abstract

An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc or zinc alloy plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the zinc or zinc alloy plating layer; forming a chromic-ion-containing silane coupling agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Description

technical field [0001] The present invention relates to a surface-treated copper foil subjected to an anti-corrosion treatment, a method for producing the surface-treated copper foil, and a copper-clad laminate using the surface-treated copper foil. Background technique [0002] Surface-treated copper foils have generally been used as materials for the manufacture of printed wiring boards, which are widely used in the electrical and electronic industries. The surface-treated copper foil is usually thermocompression bonded to an electrically insulating polymer material substrate (such as a glass-epoxy substrate, a phenolic polymer substrate, or a polyimide substrate) to form a copper-clad laminate, The laminate thus obtained can be used for the manufacture of printed wiring boards. [0003] Printed wiring boards require basic properties such as resistance to hydrochloric acid, moisture and heat. Among these properties, the most important is resistance to hydrochloric acid, ...

Claims

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Application Information

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IPC IPC(8): H05K1/09B32B15/08C23C28/00C25D1/04C25D3/38C25D3/56C25D5/16C25D5/48C25D7/00C25D7/06H05K3/38
CPCC25D5/16C25D5/48H05K3/384C23C28/00H05K3/389C25D1/04C25D3/565H05K2201/0355H05K2203/0723H05K2203/0307H05K2203/1105Y10T428/12431Y10T428/12549Y10T428/12569C25D5/605
Inventor 三桥正和片冈卓高桥直臣
Owner MITSUI MINING & SMELTING CO LTD
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