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Copper-zinc alloy electroplating bath and plating method using same

A technology of zinc alloy and electroplating, which is applied in transportation, packaging, thin material treatment, etc., can solve the problems of high toxicity, heavy burden of cyanide-containing waste liquid, etc.

Inactive Publication Date: 2011-04-20
BRIDGESTONE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing plating bath contains a large amount of cyanide, so its toxicity is a big problem, and the burden of treating waste liquid containing cyanide is also heavy

Method used

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  • Copper-zinc alloy electroplating bath and plating method using same
  • Copper-zinc alloy electroplating bath and plating method using same
  • Copper-zinc alloy electroplating bath and plating method using same

Examples

Experimental program
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Embodiment 1

[0040] (Examples 1 to 7, Comparative Examples 1 and 2)

[0041] According to the composition of the copper-zinc alloy electroplating bath shown respectively in the following Tables 1 and 2, the copper-zinc alloy electroplating baths of Examples 1 to 7 and Comparative Examples 1 and 2 were prepared according to the following Tables 1 and 2. The plating conditions shown are copper-zinc alloy plating treatment. The evaluation of the plating bath used the plating deposition efficiency and the Ra ratio. The obtained results are collectively shown in Tables 1 and 2 below.

[0042]

[0043] The plating deposition efficiency represents the ratio of the actual deposition amount to the theoretical deposition amount in percentage. The larger the value, the smaller the amount of hydrogen generation, and it is possible to form a uniform and glossy plating layer, and it also means that there is less energy loss and the productivity of the plating layer is excellent.

[0044]

[0045] T...

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Abstract

Disclosed is a copper-zinc alloy electroplating bath, and a plating method using the same, capable of forming a uniform, brilliant plated layer of the intended composition and having a wide current density range, without the use of a cyanogen compound. The copper-zinc alloy electroplating bath contains a copper salt, a zinc salt, a pyrophosphoric acid alkali metal salt or a tartaric acid alkali metal salt, and nitrate ions. It is preferable that the concentration of the aforementioned nitrate ions be 0.001-0.050 mol / L. Furthermore, it is preferable that the pH of the aforementioned copper-zinc alloy electroplating bath be in the range of 8-14. Furthermore, in addition to the copper salt, zinc salt, pyrophosphoric acid alkali metal salt, and nitrate ions, it is preferable that an amino acid or at least one salt thereof be included, and histidine can be used favorably as the aforementioned amino acid.

Description

technical field [0001] The present invention relates to a copper-zinc alloy electroplating bath and a plating method using the same, and in particular relates to copper capable of forming a uniform lustrous copper-zinc alloy plating layer having a target composition within a wide range of current densities without containing cyanide - Zinc alloy electroplating bath and plating method using same. Background technique [0002] At present, copper-zinc alloy plating is widely used in industry as decorative plating because it imparts a brassy metallic luster and tone to metal products, plastic products, and ceramic products. However, the existing plating bath contains a large amount of cyanide, so its toxicity is a big problem, and the burden of treating waste liquid containing cyanide is also heavy. [0003] As related solutions, many copper-zinc alloy plating methods that do not use cyanide have been reported so far. For example, continuous plating is a method for actually pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/58C25D7/06
CPCC25D3/58C25D7/0607Y10T428/12799
Inventor 菅野裕士
Owner BRIDGESTONE CORP
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