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Improved full-automatic glue dispensing machine

A fully automatic and improved technology, which is applied in the direction of coating, liquid coating device on the surface, etc., can solve problems such as poor dispensing, uneven heating, affecting production process and product quality, etc., to improve dispensing quality, The effect of good fluidity

Active Publication Date: 2013-06-12
DONGGUAN ANDA AUTOMATIC EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The Chinese patent application document with the application number "200710025200.2" and the patent name "dispenser heating device" includes a heating body and an external heating block. Multiple through holes are used to heat the product to be dispensed placed on the heating device. The heating device with the above structure causes the product to be heated unevenly, resulting in poor dispensing, which affects the production process and product quality

Method used

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  • Improved full-automatic glue dispensing machine
  • Improved full-automatic glue dispensing machine
  • Improved full-automatic glue dispensing machine

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Embodiment Construction

[0024] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

[0025] Such as Figure 1 to Figure 7 As shown, an improved automatic dispensing machine includes a frame body, an X-direction translation mechanism, a Y-direction translation mechanism, a spray head and a plate transporting workbench. The Y-direction translation mechanism includes a Y-direction drive mechanism, a Y-axis slide Rail 1 and the Y-direction translation seat 2 installed on the Y-axis slide rail 1, the X-direction translation mechanism includes the X-direction drive mechanism, the X-axis slide rail 3 installed on the Y-direction translation seat 2, and the spray head includes a head The head base 4 and the injection valve 5 installed on the head base 4, the head base 4 is installed...

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Abstract

The invention relates to the technical field of glue dispensing machine equipment, in particular to an improved full-automatic glue dispensing machine, which comprises a machine frame body, an X-direction translation mechanism, a Y-direction translation mechanism, a jet head portion and a transportation board platform. The Y-direction translation mechanism comprises a Y-direction driving mechanism, a Y-axis sliding rail and a Y-direction translation seat installed on the Y-axis sliding rail. The jet head portion comprises a head portion seat and a jet valve installed on the head portion seat.A heating assembly installed under the transportation board platform comprises a heating body arranged on the machine frame body. Air vents of the improved full-automatic glue dispensing machine are evenly distributed at the top of a hot wind chamber and enable hot wind to be evenly blown to a printed circuit board (PCB), thereby enabling the PCB to be heated evenly, preventing the PCB from beingheat partially, reducing negative influence of the PCB on electric elements due to expanding with heat and retracting with cold and improving product yield of the PCB.

Description

technical field [0001] The invention relates to the technical field of dispensing machine equipment, in particular to an improved automatic dispensing machine. Background technique [0002] The glue dispenser is a commonly used injection molding equipment, which is widely used. It is to pre-dot a special glue on the position where the patch needs to be placed on the PCB to fix the patch component, and then go through wave soldering after curing. In the field of SMT (Surface Mount Technology), the dispenser is mainly used for dispensing and curing the chip electronic components in the PCB board. And other factors lead to the failure probability of components, thereby prolonging the service life of the product. [0003] Therefore, the dispensing and curing of surface components plays a very important role in the SMT process. In the dispensing process, the ambient temperature has a great influence on the viscosity and flow rate of the glue. If the temperature is too low, ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C9/14B05C5/00B05C11/00
Inventor 刘飞张攀武
Owner DONGGUAN ANDA AUTOMATIC EQUIP