Method for producing dual-interface card

A dual-interface smart card, dual-interface technology, applied in the field of information, can solve the problems of uneven front of the dual-interface module, affecting use, poor precise control of heating time, etc.

Inactive Publication Date: 2012-02-22
张开兰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] However, this method also has some flaws. For example, the thermal head heats the solder on the module pad from the front of the dual-interface module, which may cause unevenness on the front of the dual-interface module, which affects subsequent use, and the heating time is not easy to control accurately, which is easy to cause Excessive heat causes depressions on the back of the card base, affecting the appearance of the card base

Method used

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  • Method for producing dual-interface card
  • Method for producing dual-interface card
  • Method for producing dual-interface card

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Embodiment Construction

[0042] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0043] like image 3 As shown, Embodiment 1 of the present invention provides a method for producing a dual-interface card, the method comprising:

[0044] S101. The antenna layer with metal wires made by etching copper, etching aluminum, electroplating copper or conductive silver paste;

[0045] Wherein, preferably, the thickness of the metal layer of the metal antenna is less than 0.05 mm, the carrying material is polyester plastic, and the thickness is 0.02-0.20 mm;

[0046] S102. Make a punching layer including a through hole, the punching layer covers one side of the metal antenna, and the through hole covers two antenna pad areas of the antenna layer;

[0047] S103. Place a front printing layer and a lining layer on the front of the punching layer, place a back printing layer and a lining layer on the back of the antenna layer, and obtain a double-int...

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Abstract

The invention discloses a method for producing a dual-interface card. In the prior art, an etched copper antenna, an etched aluminum antenna, an electro copper antenna or a conductive silver paste antenna is employed; and the antenna and a copper bonding pad of a dual-interface module are connected by using a soldering method, so that problems of low welding efficiency and large module deformation are caused; however, the above-mentioned problems are solved by utilizing the method provided in the invention. Moreover, the method can be applied to fully automatic and mass production, so that a production rate, welding reliability and a yield can be substantially improved. Furthermore, expensive and high precision groove milling equipment is completely unnecessary in the working mode, so that costs are reduced as well as reliability and stability of the dual-interface card are enhanced.

Description

technical field [0001] The invention relates to the field of information technology, in particular to a method for producing a dual-interface card. Background technique [0002] The current production process of dual-interface smart cards generally includes the following: [0003] like figure 1 As shown, the first is the production of the antenna layer. Generally, ultrasonic waves are used to embed copper enameled wires on the antenna substrate to form the antenna layer. Since the two ends of the antenna must have a suitable relative position to fit the two pads of the dual interface module, one end of the antenna will cross the inner ring from the outer ring to a proper position from the other end of the antenna, and this structure is easy to cause Short circuit, therefore, the wound antenna must use enameled wire to avoid short circuit of the antenna circuit. [0004] Next, the other components of the card base are stacked in order and laminated. [0005] Put the lamin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07H01Q1/22H01Q1/38
Inventor 张开兰
Owner 张开兰
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