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Manufacturing method of busbar module and busbar module

A technology of busbar module and manufacturing method, which is applied in the direction of cable/conductor manufacturing, root rod/rod/wire/strip conductor, electrical components, etc., which can solve the problems of production cost, busbar deformation, resin deformation, etc., and reduce production cost , reducing the effect of bending and deformation

Inactive Publication Date: 2016-02-17
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, the manufacturing method of the busbar module disclosed in Patent Document 1 has a problem that since it is difficult to make the flow speed of the resin on both sides of the busbar the same, a resin pressure difference occurs on both sides of the busbar, thereby causing bending and deformation of the busbar.
More specifically, the technology of Patent Document 1 can quickly spread the injected resin liquid to the back of the bus bar, that is, the bus bar gap side, through the injection pressure relief hole, but the resin liquid reaches both sides (side parts) of the bus bar slowly, As a result, a resin pressure difference occurs between the busbars, causing bending in the busbars, etc.
[0017] The manufacturing method of the busbar module disclosed in Patent Document 2 has the following problems: insufficient consideration is given to the resin pressure applied between the busbars, and when the width and length of the resin are large relative to the thickness of the busbars, the busbars are deformed by the resin pressure
In more detail, the technology of Patent Document 2 discloses two methods. The first method is to fix one end of a pair of busbars with a flask, but since the other end is not fixed with a flask, there are the following problems, When injecting resin, the distance between busbars cannot be kept constant due to the injection pressure
In addition, the second method is to bring the heater into contact with the outer surface of the bus bar and moderately pressurize the outer surface of the bus bar while heating the bus bar. It is disclosed, and there is a problem that if the pressure is too large, the resin will be deformed, and the distance between the busbars cannot be maintained accurately
[0018] The manufacturing method of the busbar module disclosed in Patent Document 3 has the following problem: Since the resin sheet is inserted between the busbars and then the surrounding area is molded with resin, the manufacturing process requires at least two steps, and the production cost is high.
More specifically, the technique of Patent Document 3 is to arrange an insulating polymer part made of an insulating polymer between a pair of bus bars, and to cover the insulating polymer part and the pair of busbars with a molding part made of an insulating polymer. Around the busbar, however, there are problems in that it takes cost and effort to arrange the insulating polymer part, and the melting point has to be individually specified for each insulating polymer, and the manufacturing process is complicated and cumbersome.

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  • Manufacturing method of busbar module and busbar module
  • Manufacturing method of busbar module and busbar module
  • Manufacturing method of busbar module and busbar module

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Embodiment Construction

[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0061] busbar module

[0062] figure 1 It is a perspective view schematically showing the structure of the bus bar module of this embodiment.

[0063] Such as figure 1 As shown, the busbar module 10 of the present embodiment has: a first busbar 11; a second busbar 12 disposed opposite to the first busbar 11 at a predetermined interval; and an insulating resin 13. The insulating resin 13 Formed between the first bus bar 11 and the second bus bar, the sides of the first bus bar 11 and the second bus bar 12 , and the ends of the outer surfaces of the first bus bar 11 and the second bus bar 12 .

[0064] The busbar module 10 is a module that can be used for supplying large currents around power supplies of various industrial equipment, and is used when a low-inductance electrical wiring component is required as wiring between electrical components.

[0065] The busbar m...

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Abstract

The invention provides a bus module manufacturing method, which can reduce bending and deformation of a bus during the manufacturing process and reduce the production cost, and a bus module. The bus module manufacturing method comprises the steps of: firstly, contacting the outer surface of a first bus (11) with a first protruding part (102) of a first die (100) and configuring the first bus to the first die; secondly, contacting the outer surface of a second bus (12) with a second protruding part (202) of a second die (200) and configuring the second bus to the second die; then, configuring a third die (300) between the first and second dies, wherein the third die has a thickness for separating the first and second buses for a preset distance and has a hole (301) corresponding to the first and second buses in terms of shape; and finally, filling insulating resins to the hole (301) of the third die so as to realize die molding and to achieve the combination of the first bus (11) and the second bus (12).

Description

technical field [0001] The invention relates to a manufacturing method of a busbar module and the busbar module. Background technique [0002] Conventionally, such a bus bar has been used instead of a power supply line and the like, and its shape is an elongated flat metal body. The cross-section of the electric wire is circular, whereas the cross-section of the bus bar is rectangular, so it is superior in heat dissipation and has a larger surface area than the electric wire, so it is used for electrical components that require large surface currents. [0003] In addition, there is a busbar module in which busbars are laminated with narrow gaps for the purpose of electrical insulation of a plurality of busbars, and the spaces between the busbars and the surrounding areas of the busbars are molded at once with an insulating resin. . [0004] As the prior art of such a busbar module, for example, those disclosed in Patent Documents 1 to 3 are known. [0005] The manufacturi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/02H01B13/00B29C45/00B29C45/27
Inventor 山本哲丹波昭浩
Owner HITACHI METALS LTD