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Wafer lens and manufacturing method thereof

A technology of wafer lens and lens part, which is applied in the direction of lens, other household appliances, applications, etc., to achieve the effect of suppressing warpage

Inactive Publication Date: 2012-04-04
KONICA MINOLTA OPTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For imaging lenses used in such imaging devices built into portable terminals, the balance between ultra-miniaturization and mass production of portable terminals is even more required, and it is difficult for imaging lenses made of only resin materials to meet this requirement.

Method used

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  • Wafer lens and manufacturing method thereof
  • Wafer lens and manufacturing method thereof
  • Wafer lens and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Deformed example 1

[0087] figure 1 , figure 2 The wafer lens 10 is a so-called meniscus lens in which the concave-convex shape lens portions 14a, 16a are formed with the resin portion 14 and the resin portion 16, but it can also be replaced figure 1 , figure 2 The shape of the lens part 14a, 16a is Figure 5 (a)~ Figure 5 The shape shown in (c) (the same applies to the wafer lens 30).

[0088] That is, it can be Figure 5 The non-lens portion 16b shown in (a) is single planar, also can be as Figure 5 The non-lens portion 14b shown in (b) is in a concavo-convex shape, and can also be as Figure 5 Both the non-lenses 14b and 16b shown in (c) have concavo-convex shapes. Figure 5 (a)~ Figure 5 All the shapes of (c) can suppress the warpage of the glass substrate 12 without reducing optical performance.

[0089] and Figure 5 (a) compared to the non-lens portion 16b, figure 2 The non-lens portion 16b in (b) has a large convex shape at the periphery of the lens portion 16a, and has a...

Deformed example 2

[0091] It is also possible not to form an imagefigure 1 , figure 2 A concave-convex lens like the middle wafer lens 10, but as Figure 6 As shown in (a) and (b), a resin portion 18 not having an optical function is formed on either of the front and back surfaces of the glass substrate 12 (the same applies to the wafer lens 30). The resin portion 18 may have a planar shape in which resin is applied to the glass substrate 12 . In this case, forming the resin portion 18 without optical function has an effect of suppressing warping of the glass substrate 12 compared to the case where the resin portion 18 is not formed. From the perspective of lens design, since the resin portion 18 does not have an optical function, it can be easily incorporated as a component of the wafer lens 10 .

Deformed example 3

[0093] It is also possible not to form an image figure 1 , figure 2 A concave-convex lens like the middle wafer lens 10, but as Figure 7 As shown in (a) and (b), the resin portion 14 or the resin portion 16 is formed on both front and back surfaces of the glass substrate 12 (the same applies to the wafer lens 30). In the case where the front and back surfaces of the glass substrate 12 are convex or concave in this way, it is also possible to make the non-uniform state caused by the center thickness of the front and back of the glass substrate 12, the shape of the optical surface, the curing shrinkage rate of the resin 14A or the resin 16A, etc. By changing the shape (non-lens portion 14b, 16b) other than the optical surface, the force to pull the glass substrate 12 from both surfaces is uniform, and the glass substrate 12 that is less warped is formed.

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Abstract

Disclosed is a wafer lens in which the warpage of a glass substrate included therein can be prevented. Specifically disclosed is a wafer lens (10) including a glass substrate (12), a first resin part (14) composed of a curable resin, and a second resin part (16) composed of a curable resin. In each of the first resin part (14) and the second resin part (16), two or more lens parts (14a), (16a) are formed. The first resin part (14) contains the resin in the same volume as that in the second resin part (16).

Description

[0001] This application is a divisional application of a patent application filed by Konica Minolta Precision Optics Co., Ltd. entitled "Wafer Lens and Its Manufacturing Method", the application number is 200980142378.2, and the international filing date is September 9, 2009. technical field [0002] The present invention relates to a wafer lens and a manufacturing method thereof. Background technique [0003] The so-called camera module is mounted in a portable terminal of small and thin electronic equipment such as a mobile phone and a PDA (Personal Digital Assistant), so that not only audio information but also image information can be transmitted to remote locations. Solid-state imaging elements such as CCD-type image sensors and CMOS-type image sensors are used as imaging elements used in the above-mentioned imaging devices. In recent years, high-pixel imaging elements have progressed, and higher image resolution and performance are required. [0004] As the imaging len...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B3/00G02B1/04B29C39/02B29C39/12
CPCB29C39/025G02B3/0031B29C39/12B29C39/006B29L2011/0016G02B13/006G02B13/0085
Inventor 福田泰成
Owner KONICA MINOLTA OPTO