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Board grinding method for removing orifice burrs of printed circuit board (PCB)

A PCB board, grinding board technology, applied in grinding machines, grinding/polishing equipment, machine tools suitable for grinding workpiece edges, etc., can solve problems such as affecting the reliability of PCB boards, and avoid unidirectional removal of holes by grinding The effect of copper on the bottom of the mouth

Inactive Publication Date: 2012-04-18
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the PCB board manufacturing process, the drilled PCB board is usually brushed, usually a needle brush, to remove the burrs and burrs of the hole, but due to the inherent characteristics of the needle brush, the copper skin of the hole will be removed at the same time, resulting in a hole in the hole. No copper plating, which affects the reliability of the PCB board

Method used

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  • Board grinding method for removing orifice burrs of printed circuit board (PCB)
  • Board grinding method for removing orifice burrs of printed circuit board (PCB)
  • Board grinding method for removing orifice burrs of printed circuit board (PCB)

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Embodiment Construction

[0015] Such as figure 1 As shown, it is a schematic diagram of a preferred embodiment of a grinding method for removing orifice burrs from a PCB board of the present invention.

[0016] The grinding plate method of this PCB board removal orifice burr, comprises the steps:

[0017] Step 1: Provide a grinding machine and the drilled PCB board 10, the grinding machine includes two pairs of grinding wheels 20, upper and lower, and two grinding wheels 21 of each pair of grinding wheels 20 are respectively provided with grinding brushes;

[0018] Step 2: grinding the PCB board 10, the PCB board 10 is located between the upper and lower pairs of grinding wheels 20, and the upper and lower sides of the PCB board 10 are respectively brushed by the grinding brushes of the upper and lower pairs of grinding wheels 20. The lower two sides carry out grinding plate processing, to remove the orifice burr of drilling, during grinding plate, the rotation direction of two grinding wheels 21 of ...

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Abstract

The invention relates to a board grinding method for removing orifice burrs of a printed circuit board (PCB). The method comprises the following steps of: 1, providing a board grinding machine and a drilled PCB, wherein the board grinding machine comprises a pair of upper grinding wheels and a pair of lower grinding wheels, and two grinding wheels of each pair are respectively provided with grinding brushes; and 2, grinding the PCB which is positioned between the two pairs of upper and lower grinding wheels, and respectively grinding the upper and lower sides of the PCB by the grinding brushes of the two pairs of upper and lower grinding wheels to remove the drilled orifice burrs, wherein the rotating directions of the two grinding wheels of each pair are opposite when the board is ground. According to the board grinding method for removing the orifice burrs of the PCB, because the positive and negative grinding wheels are adopted for grinding the board, the drilled orifice burrs can be effectively removed, and the grinding brushes can be effectively prevented from removing the bottom copper of the orifice in a single direction.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards (Printed Circuit Board, PCB), in particular to a grinding method for removing burrs from orifices of PCB boards. Background technique [0002] During the PCB board manufacturing process, the drilled PCB board is usually brushed, usually a needle brush, to remove the burrs and burrs of the hole, but due to the inherent characteristics of the needle brush, the copper skin of the hole will be removed at the same time, resulting in a hole in the hole. There is no copper plating, which affects the reliability of the PCB board. Therefore, such defects need to be improved urgently. Contents of the invention [0003] Therefore, the object of the present invention is to provide a grinding method for removing burrs from the orifice of a PCB board. By adopting positive and negative grinding wheels, the burrs from the orifice can be effectively removed and the unidirectional removal of t...

Claims

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Application Information

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IPC IPC(8): B24B9/00
Inventor 刘攀黎钦源曾志军曾红
Owner DONGGUAN SHENGYI ELECTRONICS
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