Method for inspecting bonding structure of substrate and bonding structure inspection apparatus
A technology for bonding structures and substrates, used in instruments, electrical components, analytical materials, etc.
Active Publication Date: 2016-03-02
AGENCY FOR SCI TECH & RES +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, some critical wire bond quality issues such as die tilt, lifted leads, sagging coils cannot be measured using 2D cameras
Method used
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[0052] The following detailed description refers to the accompanying drawings, which show, by way of illustration, specific details and embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The various embodiments are not necessarily mutually exclusive, and some embodiments can be combined with one or more other embodiments to form new embodiments.
[0053] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Implementations or designs described herein as "exemplary" are not necessarily to be construed as preferred or advantageous over other implementations or designs.
[0054] Embodiments may provide a photodetection device. The light detection device may include: a bo...
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In an embodiment, a method for inspecting a bonding structure of a substrate may be provided. The method may comprise: providing a substrate comprising a bonded structure to be inspected; determining one or more stereoscopic images of one or more predetermined regions of interest comprising portions of the bonded structure to be inspected, the predetermined regions of interest corresponding to the reference substrate One or more two-dimensional characteristic parameters and one or more of the joint structure to be inspected are determined from one or more of the plurality of predetermined interest areas; a plurality of three-dimensional characteristic parameters; and judging whether the determined characteristic parameters meet at least one predetermined quality standard with respect to the reference model.
Description
technical field [0001] Embodiments relate to a method for inspecting a bonded structure of a substrate and a bonded structure inspection apparatus. Background technique [0002] Semiconductor devices such as integrated circuit chips can be electrically connected to leads on a lead frame by a process called wire bonding. The wire bonding process involves using wires to connect connection pads on a chip or die to leads in a lead frame. Once the wire bonding of the chip to the leadframe is complete, the chip and leadframe can be further packaged in ceramic or plastic to form an integrated circuit device. [0003] In many cases, wire bond quality can be manually inspected by a human operator using a microscope. However, this manual method can be time consuming and expensive. Needless to say, it is desirable to perform automated wire bond inspection. However, for automated wire bond inspection, there are many challenges that need to be addressed. For example, due to the rela...
Claims
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IPC IPC(8): H01L21/66G01N21/956G01N21/29H01L21/60
CPCG01N21/8806H01L23/544H01L24/45H01L24/48H01L24/49H01L24/85H01L2223/54426H01L2223/54473H01L2224/45014H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/48472H01L2224/4903H01L2224/49051H01L2224/78901H01L2224/85121H01L2224/859H01L2924/01005H01L2924/01013H01L2924/01014H01L2924/01015H01L2924/01027H01L2924/01075H01L2924/01077H01L2924/01079H01L2924/01082H01L2924/14H01L2924/01033H01L2924/014H01L2224/0603H01L2224/73265H01L2924/10253H01L2924/12041H01L2924/1461H01L2224/45015H01L2924/12042H01L2224/05552H01L2224/05553H01L2224/05554H01L2924/00014H01L2924/00H01L2924/20751H01L2924/206
Inventor 钟金鹏林秋江徐健刘通唐再昕林伟业
Owner AGENCY FOR SCI TECH & RES