Method and device for prying up BGA in dyeing test

A technology of guide bolts and printed boards, applied in hand-held tools, manufacturing tools, etc.

Active Publication Date: 2016-03-23
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a method and device for lifting BGA in the dyeing test, so as to solve the problem that the existing mechanical separation method in the dyeing test cannot well realize the separation of the BGA from the printed board after dyeing. The problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for prying up BGA in dyeing test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] see figure 1 , the device for prying up the BGA in the dyeing test of the present invention comprises a fastening guide bolt 101, a small nut 102, a guide seat 201, a built-in threaded sleeve 202), a large nut 203, a first base 301, a second base 302, seven Short M4 bolts 401; between the guide seat and the first base, between the first base and the second base are connected by short M4 bolts, the guide seat is stacked above the first base, and the built-in threaded sleeve is arranged in the guide seat and It can move up and down. The built-in threaded sleeve is connected with the first base. The tightened guide bolts pass through the built-in threaded sleeve and the first base in turn. A small nut is placed on the exposed tail of the bolt, and the small nut is placed above the built-in threaded sleeve, and a large nut is nested outside the built-in threaded sleeve. Abutting against the printed board, the second base is connected in the first base and abutted against t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a device for prizing up a BGA (ball grid array) in a staining test, which is used for separating the BGA from a printed board. The device comprises a tightening guide bolt, a guiding base and a first base, wherein the guiding base is overlapped on the first base; a built-in screw sleeve capable of moving up and down is arranged inside the guiding base; the built-in screw sleeve is communicated with the first base; the tightening guide bolt penetrates through the built-in screw sleeve and the first base sequentially; an exposed root part of the tightening guide bolt is used for realizing pouring encapsulation with the surface of the BGA; a small nut is sleeved on an exposed tail part of the tightening guide bolt; the small nut is arranged above the built-in screw sleeve; a big nut is nested outside the built-in screw sleeve; the lower end surface of the big nut contacts the upper end surface of the guiding base; and the lower part of the first base is used for pressing against the printed board. The invention also discloses a method for prizing up the BGA in the staining test.

Description

technical field [0001] The invention relates to a separation technology of a ball grid array (BGA) and a printed board, in particular to a method and a device for prying up the BGA in a dyeing test. Background technique [0002] Ball grid array (BGA) packaging has been widely used in various electronic products due to its advantages in efficiency and functions; and in low-end electronic products, due to design cost factors, reflow soldering and soldering are still widely used. The process route of wave soldering double-sided mixed assembly. Due to the instantaneous temperature impact on PCBA components and local thermal stress caused by the wave soldering process, certain quality and reliability problems have been brought to the application of BGA. According to the research and statistics of relevant institutions, the proportion of solder joint failure in the failure defects of electronic products is as high as 80%, which makes the miniaturization and high-density electroni...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B25B27/02
Inventor 林晓玲宋芳芳刘玉清
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap