Composite adhesive sheet, film comprising same and manufacturing method of film
A technology of adhesive sheet and composite glue, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problems of insufficient heat conduction speed and uneven heat conduction performance of thermal conductive film
Active Publication Date: 2012-05-23
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
At present, the thermal conduction speed of the commonly used thermal film is not fast enough, and the thermal conductivity is not uniform enough.
Method used
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[0026] The composite adhesive sheet, film and production method thereof provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0027] see figure 1 , The technical solution provides a film 10, which includes a first release substrate 11, a composite adhesive sheet 12 and a second release substrate 13 stacked in sequence.
[0028] The first release substrate 11 is used to carry the composite adhesive sheet 12 . The first release substrate 11 refers to a sheet material having at least one release surface. The release surface refers to a surface with low surface energy, which can adhere to other materials and is easy to separate the adhered materials. The first release substrate 11 can be a PET release film, that is, its substrate is PET, and at least one surface of the substrate is coated with materials such as silicone oil to form a sheet material on the release surface, so that it can stick ...
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Abstract
The invention relates to a composite adhesive sheet, which is provided with a first contact surface contacted with an object to be stuck. The composite adhesive sheet comprises a resin substrate, a plurality of heat conducting particles and a plurality of carbon fibers, wherein the carbon fibers are basically vertical to the first contact surface; the average length of the carbon fibers is 80-110 percent of the thickness of the composite adhesive sheet; the heat conducting particles are positioned among the carbon fibers; the average particle size of the heat conducting particles is 70-90 percent of the thickness of the composite adhesive sheet; the resin substrate is distributed among the heat conducting particles and among the carbon fibers; and the viscosity of the resin substrate is 8,000-18,000 mPa.s. In the technical scheme, the composite adhesive sheet has excellent heat conducting performance and heat conducting efficiency. The technical scheme further provides a film comprising the composite adhesive sheet and a manufacturing method of the film.
Description
technical field [0001] The invention relates to the adhesive technology, in particular to a composite adhesive sheet with better thermal conductivity, a film including the composite adhesive sheet and a method for making the film. Background technique [0002] With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.O oki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents , Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] As the integration of circuit boards increases, circuit board products often emit a lot of heat when they are actually working. If the heat cannot be exported in time, it will affect the signal transmission of the circuit board. One way to speed up the heat dissipation of circuit board products is to us...
Claims
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IPC IPC(8): C09J7/00C09J163/00C09J9/00C09J11/04C09J7/02
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD