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Liquid vaporization system

A liquid and vaporizer technology, used in gas generating devices, chemical instruments and methods, chemical/physical processes, etc., can solve problems such as impaired processing stability, and achieve the effect of suppressing changes in vaporization and promoting vaporization.

Active Publication Date: 2012-05-23
CKD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, the mixed gas of the vaporized liquid material and the carrier gas is supplied to the wafer, and if the concentration of the liquid material in the mixed gas fluctuates during processing, it will cause problems such as impaired processing stability.

Method used

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  • Liquid vaporization system
  • Liquid vaporization system
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no. 1 Embodiment approach

[0087] Hereinafter, a first embodiment embodying the present invention will be described with reference to the drawings. This embodiment is an embodiment of a chemical solution supply system used in a production line of a semiconductor device or the like. First, according to figure 1 The outline diagram of this system explains the basic structure of this system.

[0088] In this embodiment, a liquid vaporization system is used in order to vaporize the hydrophobization treatment liquid which is a liquid material. In this system, the adhesion performance of the resist liquid to the wafer is improved by coating the vaporized liquid material on the surface of the semiconductor wafer (hereinafter referred to as the wafer).

[0089] Such as figure 1 As shown, the liquid vaporization system 10 is provided with a liquid vaporization device 20 for vaporizing liquid materials. The liquid vaporization device 20 includes a pump 11 , a vaporizer 12 , a suction side valve 13 , and a dis...

no. 2 Embodiment approach

[0141] Below, refer to Figure 5 The second embodiment of the present invention will be described, and the differences from the first embodiment will be mainly described. The liquid vaporization system 10 of this embodiment differs from the first embodiment in terms of the configuration of the liquid vaporization device 120 and the control content of the controller 40 , but is the same as other points. Figure 5 It is a plan view showing the structure of the liquid vaporization device 120 of the second embodiment. The liquid vaporization device 120 of the present embodiment is the same as that of the first embodiment in that the liquid material is vaporized using the screen 124. However, in this embodiment, the liquid material is supplied to the screen 124 and the liquid adhesion surface ( (to be described later), this point is different from the first embodiment.

[0142] The liquid vaporization device 120 has a pump 111, a vaporizer 112, a suction side valve 113, and a dis...

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Abstract

Disclosed is a liquid vaporization system which is capable of promoting vaporization of liquid material without problems caused by unvaporized matter. The liquid vaporization system (10) comprises a liquid vaporization assembly (20). This assembly (20) comprises a pump (11) and a vaporizer (12). The vaporizer (12) comprises a case (21), a heater placed inside the case (21), a heat-accumulating plate (23) heated by the heater, and a mesh (24) placed on the heat-accumulating plate (23). The mesh (24) is formed by interweaving a wire material (24a) in a flat plate shape as a whole. By overlayingthe mesh (24) on the top face of the heat-accumulating plate (23), fine roughness is provided on the heat-accumulating plate (23) by the mesh (24). Above the mesh (24), a nozzle (27) is provided. From the nozzle (27), liquid material is dropped onto the heat-accumulating plate (mesh (24)). The liquid material spreads in a thin film state over the heat-accumulating plate (23), and is heated and vaporized on the upper face of the heat-accumulating plate (23).

Description

technical field [0001] The present invention relates to liquid vaporization systems. Background technique [0002] Generally, in the manufacture of semiconductor devices, in order to improve the adhesion performance of the resist liquid to the wafer, a vaporizer is used to vaporize the liquid material used to change the hydrophilic surface into a hydrophobic surface, and the vaporized liquid material is passed Perform surface treatment of the wafer. As such a vaporizer, for example, a vaporizer that vaporizes a liquid material by heating it with a heater is generally used. [0003] The liquid material vaporized by the vaporizer is generally supplied to the wafer accommodated in the chamber through a carrier gas. In this case, a mixed gas of vaporized liquid material and carrier gas is supplied to the wafer, and if the concentration of the liquid material in the mixed gas fluctuates during processing, problems such as impaired processing stability may occur. Therefore, for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D1/22B01J7/00H01L21/027
CPCB01B1/005B01D1/221B01J7/00H01L21/0273
Inventor 纐缬雅之板藤宽
Owner CKD