Immersion cooling electronic equipment

An electronic equipment, immersion technology, applied in the direction of electrical equipment structural parts, cooling/ventilation/heating renovation, electrical components, etc., can solve the problems of high complexity of the cooling system and poor sealing reliability.

Active Publication Date: 2012-06-20
HUAWEI MACHINERY
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides electronic equipment using immersion cooling, which is used to solve the problems of poor sealing reliability and high complexity of the cooling system in the prior art. The embodiment of the present invention has a simple sealing structure and high sealing reliability

Method used

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Embodiment approach

[0066] It is worth noting that the aforementioned five implementations of electronic equipment 200, 300, 400, 500, and 600 mainly use the electronic equipment 100 of the first implementation as a reference to describe various aspects of the concept of the implementation of the present invention. It should be understood that the present invention also has other embodiments, such as:

[0067] In other embodiments, the flow of the cooling working medium 40 in the internal space 30 may be heat exchange by forced convection generated by excitation components such as pumps;

[0068] In other implementation manners, the aforementioned various implementation manners may be combined with each other, for example: in the electronic device 100, settings such as Figure 6 The heat dissipation structure shown and the side space 40 is set as Figure 7 An open space with an opening on one side; or, in the electronic device 200, such as Figure 9 Shown through hole 26 and set as Figure 6 T...

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Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a casing and a circuit board arranged in the casing, wherein the circuit board comprises a first working area and a second working area between which an isolation groove is formed; a first electronic element arranged on the circuit board and requiring to be cooled is arranged in the first working area; the casing comprises a plurality of isolation walls; the isolation walls are in tight fit with the isolation groove to form an enclosed internal space in the casing; the first working area is sealed in the internal space; a cooling working medium is arranged in the internal space; and the first electronic element is immersed in the cooling working medium. In the embodiment of the invention, the isolation groove and the isolation walls are in tight fit to form the enclosed internal space in the casing, the cooling working medium is arranged in the internal space, a heating electronic element is immersed in the cooling working medium for being cooled down, and electronic elements which are not required to be cooled down, particularly connectors, are arranged outside the internal space in an insolating manner. Therefore, the electronic equipment has the advantages of simple sealing structure and high reliability.

Description

technical field [0001] The invention relates to a cooling technology for electronic equipment, in particular to an electronic equipment adopting an immersion cooling method. Background technique [0002] If the heat generated by electronic equipment in the prior art, such as various communication equipment, is not properly dissipated, the attenuation and aging of equipment performance will be accelerated, resulting in poor reliability of communication equipment and increasing maintenance costs. [0003] Existing communication equipment mainly adopts air-cooling technology to dissipate heat, for example, a fan is used to extract air to dissipate heat. However, with the increase of power consumption and thermal density of devices, problems such as hot spots and noise have become more and more prominent. [0004] In order to improve the deficiencies of air cooling technology, other cooling technologies have begun to be applied, for example, the immersion cooling method that im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20236H05K1/0209H05K7/20
Inventor 黄茂胜黄书亮
Owner HUAWEI MACHINERY
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