Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool

Abstract

The invention discloses a preparation method oriented to a fine-grain diamond abrasive material single-layer soldering tool, which relates to the technical field of manufacturing of abrasive material grinding tools. The method comprises the following steps of: grinding the working surface of a substrate, and uniformly paving a solder alloy powder layer on the working surface; feeding the substrate into a vacuum furnace for performing primary soldering under a high-temperature vacuum condition; grinding the soldered surface to form a brazing alloy layer; spraying a layer of fine-grain diamond abrasive material onto the surface of the brazing alloy layer; feeding into the vacuum furnace, and performing secondary soldering under a high-temperature vacuum condition; and after secondary soldering, taking a test sample out to obtain a single-layer soldering tool product on which fine-grain diamonds are distributed uniformly and densely. A uniform, dense, equal-height and highly-exposed abrasive material distribution form is formed on the tool while a fine soldering process can cope with grain grit, so that the tool made with a novel method can have the comprehensive performance advantages of high processing accuracy, high processing efficiency, and long service life.

Description

Technical field [0001] The invention involves the technical field of abrasive grinding tool manufacturing, especially a fine -grained diamond grinding single layer of welding tool preparation method. Background technique [0002] In recent years, with the development of modern manufacturing technology, the grinding processing of abrasive grinders as tools has not only been used in the process of processing in large margin heavy loads, but also continuously expanded to small remaining amounts of high -hard and brittle processing materials.Precision ultra -precision machining fields, such as precision processing of high -hard and crispy processing materials such as functional ceramics, optical glass, quartz, etc.In the ultra -precision processing of high -hard and brittle difficulty processing materials, grinding and polishing have always been used as the preferred processing method.The grinding uses a research tool with a grinding particle size with abrasive granularity to make th...

AI Technical Summary

Problems solved by technology

However, as far as the current brazing technology is concerned, the abrasive grain size of the single-layer brazed diamond grinding wheel is only concentrated on diamond abrasives with a thickness of 140# or less (>104μm), and the machining accuracy that can be achieved is limited.

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