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Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool

A diamond, fine-grained technology, applied in the field of abrasive tool manufacturing, which can solve problems such as processing accuracy limitations

Active Publication Date: 2012-06-27
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as far as the current brazing technology is concerned, the abrasive grain size of the single-layer brazed diamond grinding wheel is only concentrated on diamond abrasives with a thickness of 140# or less (>104μm), and the machining accuracy that can be achieved is limited.

Method used

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  • Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool
  • Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool

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Embodiment Construction

[0027] A method for preparing a single-layer brazing tool for fine-grained diamond abrasives, comprising the following steps:

[0028] The first step: if figure 1 (a), figure 1 As shown in (b), the working surface of the substrate 1 is polished, and a layer of alloy solder powder layer 2 is evenly spread on the working surface;

[0029] The second step: under the condition of high temperature and vacuum, the substrate 1 with the alloy solder powder layer 2 obtained in the first step is sent into a vacuum furnace for the first brazing;

[0030] Step 3: If figure 1 As shown in (c), the surface after brazing in the second step above is polished to form a solder layer 3;

[0031] Step 4: If figure 1 As shown in (d), a layer of fine-grained diamond abrasive 4 is spread on the surface of the solder layer 3;

[0032] The fifth step: send it into the vacuum furnace, and carry out the second brazing under the condition of high temperature and vacuum;

[0033] Step 6: If figure 1...

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Abstract

The invention discloses a preparation method oriented to a fine-grain diamond abrasive material single-layer soldering tool, which relates to the technical field of manufacturing of abrasive material grinding tools. The method comprises the following steps of: grinding the working surface of a substrate, and uniformly paving a solder alloy powder layer on the working surface; feeding the substrate into a vacuum furnace for performing primary soldering under a high-temperature vacuum condition; grinding the soldered surface to form a brazing alloy layer; spraying a layer of fine-grain diamond abrasive material onto the surface of the brazing alloy layer; feeding into the vacuum furnace, and performing secondary soldering under a high-temperature vacuum condition; and after secondary soldering, taking a test sample out to obtain a single-layer soldering tool product on which fine-grain diamonds are distributed uniformly and densely. A uniform, dense, equal-height and highly-exposed abrasive material distribution form is formed on the tool while a fine soldering process can cope with grain grit, so that the tool made with a novel method can have the comprehensive performance advantages of high processing accuracy, high processing efficiency, and long service life.

Description

[0001] technical field [0002] The invention relates to the technical field of abrasive tool manufacturing, in particular to a method for preparing a fine-grained diamond abrasive single-layer brazing tool. [0003] Background technique [0004] In recent years, with the development of modern manufacturing technology, the grinding process using abrasive tools as tools has not only been used in the processing field with large allowance and heavy load, but also continuously expanded to the small allowance of high hardness and brittle difficult-to-machine materials. In the field of precision ultra-precision machining, for example, the precision machining of high-hard, brittle and difficult-to-machine materials such as functional ceramics, optical glass, and quartz. Grinding and polishing have always been the preferred processing methods in the ultra-precision machining of high-hard, brittle and difficult-to-machine materials. Grinding is the finishing process of the surface ...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K101/00
Inventor 陈燕傅玉灿丁兰英向孙祖徐九华
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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