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Mechanical processing device and mechanical processing method

A technology for machining and machining tools, which is applied to fine working devices, stone processing equipment, metal processing equipment, etc., and can solve the problem of considering the size of fine bubbles

Inactive Publication Date: 2014-08-27
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the above-mentioned conventional cutting device, the size of the fine air bubbles contained in the cutting fluid is not particularly considered, and it cannot necessarily be said that the cutting liquid containing the fine air bubbles can be effectively used when cutting silicon with a cutting tool (processing tool). Wafer (plate) processing

Method used

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  • Mechanical processing device and mechanical processing method
  • Mechanical processing device and mechanical processing method
  • Mechanical processing device and mechanical processing method

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Embodiment Construction

[0046] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0047] The cutting device according to the first embodiment of the present invention is as figure 1 and figure 2 constituted as shown. and, figure 1 shows the basic structure of the cutting device, figure 2 show figure 1 The relationship between the cutter (processing tool) in the cutting device and the cutting fluid sprayed on the cutter is shown.

[0048] exist figure 1 and figure 2 Among them, this dicing device 100 has: a chucking table 20 on which a semiconductor wafer W (plate-shaped object) as a workpiece is placed; a dicing main unit 22 ; and a support portion 21 for supporting the dicing main unit 22 . The cutting body unit 22 has a disc-shaped cutter 18 (processing tool) attached to a rotating shaft 19 that is rotated by a drive motor (not shown). The chucking table 20 on which the semiconductor wafer W is placed can move along a predetermined direc...

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Abstract

The present invention provides a mechanical processing device and a mechanical processing method in which cutting liquid that comprises fine bubbles can be more effectively utilized in processing of plate-shaped object by processing tools. The mechanical processing device which inserts a rotating disc-shaped which processes the plate-shaped object (W) is provided with the following components: first mechanisms (14,15) which sprays first cutting liquid that comprises fine bubbles into one end face of the side of the rotating processing tool (18), which is inserted into the plate-shaped object (W); and second mechanisms (16,17) which sprays second cutting liquid that comprises fine bubbles to at least one side surface of the two side surfaces of the processing tool (18), and the dimension of the fine bubbles contained in the second cutting liquid is larger than that of the fine bubbles contained in the first cutting liquid.

Description

technical field [0001] The present invention relates to a dicing device that cuts a semiconductor wafer into a plurality of chips by cutting a rotating blade, and a machining device that processes a plate-shaped object by cutting a rotating disc-shaped processing tool. and machining methods. Background technique [0002] Conventionally, a dicing device has been proposed in which a rotating disc-shaped cutter (processing tool) cuts into a silicon wafer (plate-shaped object) to cut the silicon wafer into micro chips (Patent Document 1). In this dicing device, cutting fluids such as cleaning fluid and cooling water are used, and the cleaning fluid containing fine air bubbles (fine air bubbles) is sprayed onto the silicon wafer near the obliquely front side of the blade that cuts into the silicon wafer, and The cooling water is sprayed separately on both sides of the rotating cutter. And, the fine air bubbles mixed in the cleaning solution sprayed onto the silicon wafer are br...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/06B28D5/02
CPCH01L21/304H01L21/67051H01L21/67092
Inventor 广瀬治道牧野勉
Owner SHIBAURA MECHATRONICS CORP